Dual-Mass Vibration Absorber for Broad-Frequency Semiconductor Tools
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Solution Overview
Problem
Existing vibration reduction methods for semiconductor manufacturing apparatuses, such as anti-vibration pads and dynamic absorbers, are ineffective at low frequencies, require costly construction, or lose effectiveness over time due to changing vibration frequencies.
Innovation Solution
A vibration absorbing apparatus with dual dynamic vibration absorbers, each comprising an elastic body and a mass body, configured to collide and dissipate vibration energy across a wide frequency range, with adjustable mass positioning to match target frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dynamic absorbers are used to reduce vibrations, then vibration reduction effectiveness is improved at specific frequencies, but the effectiveness decreases when vibration frequencies change or when the set frequency changes over time
Solution Approach 1:
The vibration absorption system is divided into multiple independent dynamic absorbers, each tuned to different frequency ranges. This segmentation allows the system to handle a broader spectrum of vibration frequencies simultaneously, with each absorber unit independently targeting specific frequency bands.
Solution Approach 2:
The patent employs adjustable mass positioning mechanisms that allow the natural frequency of the dynamic absorbers to be dynamically tuned. This enables the system to adapt to changing vibration frequencies by repositioning mass bodies along the elastic bodies, maintaining effectiveness across varying operational conditions.
2Reliability
If independent foundations or floor reinforcements are used to block vibration transmission, then vibration transmission is reduced, but additional construction is required which is expensive and time-consuming
Solution Approach 1:
The invention extracts the vibration control function from the building structure (foundations and floor reinforcements) and relocates it to a portable, self-contained dynamic absorber system. This eliminates the need for costly structural modifications while achieving the same vibration isolation effect through removable apparatus.
Solution Approach 2:
The dynamic absorbers act as intermediary devices between the semiconductor manufacturing apparatus and the building structure. Instead of modifying the building structure directly, these intermediary mass-spring systems absorb and isolate vibrations, providing a non-invasive solution that protects equipment without requiring foundation or floor reinforcements.
3Reliability
If anti-vibration pads are used to mitigate vibrations, then some vibration reduction is achieved, but the effect decreases significantly at low frequencies
Solution Approach 1:
The patent changes the fundamental parameters of the vibration control system by using dynamic absorbers with adjustable mass and stiffness characteristics. Unlike fixed-parameter anti-vibration pads, the dynamic absorbers can be tuned to different frequency ranges by adjusting mass positioning, enabling effective vibration reduction across both high and low frequency ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces vibrations across a broad frequency range by dissipating energy through mechanical collisions, maintaining performance despite frequency changes, and minimizing costly structural modifications.
Implementation Method 1
a first elastic body fastened to the base plate and a first mass body fastened to the first elastic body
Implementation Method 2
the first mass body and the second mass body are configured to reduce vibration at specific frequencies transmitted to the base plate by colliding with each other
Data Source
AI summary
A vibration absorbing apparatus for semiconductor manufacturing apparatus including: a base plate configured to be secured to a semiconductor manufacturing apparatus; a first vibration absorber including a first elastic body fastened to the base plate and a first mass body fastened to the first elastic body; and a second vibration absorber including a second elastic body fastened to the base plate and a second mass body fastened to the second elastic body, wherein the second elastic body is adjacent to the first elastic body, wherein the first mass body and the second mass body are configured to reduce vibration at specific frequencies transmitted to the base plate by colliding with each other.