Selective Dual-Material Deposition on Metal and Dielectric Surfaces
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Solution Overview
Problem
Current manufacturing processes for integrated circuits require multiple steps to selectively deposit different materials on different surfaces of a substrate, which is time-consuming and inefficient.
Innovation Solution
A method involving a single vapor deposition process that uses passivation agents and sequential exposure to metal or semimetal reactants to selectively deposit different materials on distinct surfaces of a substrate, utilizing ALD-type processes to achieve self-limiting surface reactions and minimize gas phase interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple sequential deposition and etching steps are used to deposit different materials on different surfaces, then material deposition selectivity is achieved, but manufacturing time increases and productivity decreases
Solution Approach 1:
A passivation layer is formed on one surface of the substrate before the deposition process begins. This preliminary action protects the first surface during subsequent deposition, allowing selective material deposition on the second surface without requiring multiple sequential steps with intermediate etching and masking operations.
Solution Approach 2:
The passivation layer acts as an intermediary protective barrier between the deposition environment and the first surface of the substrate. This intermediary layer enables selective deposition by preventing material accumulation on the first surface while allowing deposition on the second surface, eliminating the need for complex masking and etching sequences.
2Manufacturing precision
If separate deposition processes are used for each material on different surfaces, then deposition selectivity is achieved, but process complexity increases
Solution Approach 1:
The patent combines multiple deposition operations into a single continuous process. By forming a passivation layer on the first surface before deposition, both the protection of the first surface and the deposition on the second surface are achieved in one integrated process, eliminating the need for separate deposition, masking, and etching steps for each surface.
Solution Approach 2:
The passivation layer serves multiple functions simultaneously: it protects the first surface from material deposition, provides a stable base for the subsequent deposition process, and enables selective material accumulation on the second surface. This multi-functionality simplifies the overall process by replacing multiple specialized steps with a single versatile approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for simultaneous and selective deposition of materials with different properties on different surfaces, reducing processing time and enabling materials with varied etch rates, conductivities, and refractive indices, thereby enhancing manufacturing efficiency.
Implementation Method 1
exposing the first and second surfaces to a passivation agent, such that the passivation agent selectively forms a passivation layer on the first surface relative to the second surface
Implementation Method 2
a vapor deposition process in which exposure of two different surfaces to the same vapor phase reactants selectively deposits two different materials on the two different surfaces
Data Source
AI summary
In some embodiments, methods are provided for simultaneously and selectively depositing a first material on a first surface of a substrate and a second, different material on a second, different surface of the same substrate using the same reaction chemistries. For example, a first material may be selectively deposited on a metal surface while a second material is simultaneously and selectively deposited on an adjacent dielectric surface. The first material and the second material have different material properties, such as different etch rates.