Method and apparatus for cooling an assembly comprising a conduit and system comprising such a device
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Solution Overview
Problem
High-temperature superconductor (HTSC) current guides require efficient cooling to maintain low temperatures, but existing cooling systems are costly and inefficient, particularly due to the high heat generation and material costs associated with large cross-sections needed for current connections.
Innovation Solution
A combined cooling system using gaseous helium for the power supply and liquid nitrogen for current connections, where the current connections are cooled by evaporating nitrogen from a liquid bath, allowing for efficient heat transfer and reduced material costs by achieving lower temperatures and increasing current-carrying capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid nitrogen cooling systems are used for HTSC current guides, then cooling capability is provided, but the system complexity and cost increase due to multiple nitrogen streams, pumps, sub-coolers, and expansion tanks
Solution Approach 1:
The cooling system is segmented into two independent parts: a first cooling system using gaseous helium for the power supply, and a second cooling system using liquid nitrogen for the current connections. This segmentation allows each subsystem to be optimized independently, reducing overall system complexity while maintaining effective cooling for both components.
Solution Approach 2:
The patent introduces an intermediary approach by using gaseous helium as a cooling medium for the power supply, which operates at different temperature requirements than the current connections. This intermediary cooling system for the power supply reduces the burden on the liquid nitrogen system, simplifying the overall architecture by eliminating the need for complex sub-coolers and expansion tanks.
2Quantity of substance
If large cross-section current connections are used to handle high electrical current, then current-carrying capacity increases, but material costs increase
Solution Approach 1:
The patent applies parameter changes by cooling the current connections to cryogenic temperatures using liquid nitrogen. This temperature reduction fundamentally changes the electrical properties of the connection materials, dramatically increasing current-carrying capacity without requiring larger cross-sections. The material cost is reduced because smaller, less expensive conductors can achieve the required current capacity when cooled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables cooling to temperatures below 60 K, significantly improving current-carrying capacity and reducing material costs by using a smaller helium cooling system for the power supply and inexpensive liquid nitrogen for the current connections.
Implementation Method 1
the power supply is cooled using gaseous helium
Implementation Method 2
the current connections are cooled using liquid nitrogen. In this way, a large amount of heat which is introduced into the power supply via the current connections can be absorbed
Implementation Method 3
a large amount of heat which is introduced into the power supply via the current connections can be absorbed and removed
Data Source
Figure 1
Figure 2A~2C
AI summary
A method for cooling an arrangement with a current guide (1) that is operated at a first temperature level and with two current connections (2) that are electrically conductively connected to the current guide (1) and at a second temperature level above the first Temperature levels are operated proposed. It is provided that the power supply (1) is cooled using gaseous helium and the power connections (2) are cooled using liquid nitrogen. A corresponding device for cooling and a system (100) with such a device are also the subject of the present invention.