Dual-Mode Electron Beam Imaging for Nondestructive IC Analysis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for imaging complex 3D structures like integrated circuits (ICs) face challenges such as the need for destructive processes, high costs, and long processing times, particularly with synchrotron techniques, which are expensive and require X-ray focusing optics, limiting efficiency and accessibility.
Innovation Solution
A tabletop system utilizing an electron beam generator with two modes of operation (E-mode and X-mode) for non-destructive imaging, employing electron back-scattered and secondary electrons for chemical and structural analysis, and X-rays for element density reconstruction, without the need for X-ray lenses, allowing for high-resolution imaging within a short timeframe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If synchrotron techniques are used for imaging, then imaging capability is improved, but cost and processing time increase significantly
Solution Approach 1:
The imaging process is divided into two distinct modes: E-mode for collecting electron scattering data and X-mode for collecting X-ray transmission data. This segmentation allows each mode to be optimized independently and executed efficiently, avoiding the need for continuous synchrotron operation while achieving comprehensive 3D structural information.
Solution Approach 2:
An engineered target is introduced as an intermediary between the electron beam and the sample. This target converts electron beam energy into X-rays that can penetrate the sample, enabling X-mode imaging without requiring a synchrotron source. The target acts as a mediator that translates between different interaction mechanisms.
2Measurement precision
If synchrotron techniques are used for imaging, then imaging capability is improved, but device complexity and cost increase
Solution Approach 1:
The system extracts and removes the requirement for X-ray focusing optics and synchrotron infrastructure. By using electron back-scattered and secondary electrons in E-mode, and X-rays from an engineered target in X-mode, the system achieves high-resolution imaging without complex X-ray optical components.
Solution Approach 2:
The system replaces expensive, complex synchrotron infrastructure with a simpler electron beam generator and engineered target combination. This substitution dramatically reduces device complexity and operational cost while maintaining imaging capability through the complementary use of E-mode and X-mode data collection.
3Measurement precision
If high resolution imaging is achieved, then measurement precision is improved, but processing time increases
Solution Approach 1:
The system dynamically switches between E-mode and X-mode operation to collect different types of data. This dynamic approach allows optimization of data collection speed in each mode while maintaining high resolution, as electron scattering provides rapid structural information and X-ray transmission provides complementary density information.
Solution Approach 2:
The imaging process maintains continuous useful action by collecting data from both E-mode and X-mode without requiring sample destruction or repositioning. The dual-mode approach ensures that information gathering continues efficiently throughout the process, achieving high resolution without prolonged processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high-resolution imaging of ICs with features as small as 10 nm, providing accurate and reliable results in a cost-effective and time-efficient manner, suitable for both front-end and back-end IC structures, and can be adapted for other complex 3D structures like energy conversion and biological tissues.
Implementation Method 1
employing electron back-scattered and secondary electrons for chemical and structural analysis
Implementation Method 2
employing electron back-scattered and secondary electrons for chemical and structural analysis
Implementation Method 3
employing electron back-scattered and secondary electrons for chemical and structural analysis, and X-rays for element density reconstruction
Data Source
AI summary
A system and method for imaging a sample having a complex structure (such as an integrated circuit) implements two modes of operation utilizing a common electron beam generator that produces an electron beam within a chamber. In the first mode, the electron beam interacts directly with the sample, and backscattered electrons, secondary electrons, and backward propagating fluorescent X-rays are measured. In the second mode, the electron beam interrogates the sample via X-rays generated by the electron beam within a target that is positioned between the electron beam generator and the sample. Transmitted X-rays are measured by a detector within the vacuum chamber. The sample is placed on a movable platform to precisely position the sample with respect to the electron beam. Interferometric and/or capacitive sensors are used to measure the position of the sample and movable platform to provide high accuracy metadata for performing high resolution three-dimensional sample reconstruction.