Dual-Mode Heat Dissipating Module for High-Speed Processors
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Solution Overview
Problem
Conventional electronic devices with single heat dissipating units, such as air cooling or water cooling systems, are inadequate for high-speed processors as they require manual replacement and may not efficiently meet thermal dissipation needs, leading to inefficiencies and waste when switching between cooling modes.
Innovation Solution
A heat dissipating module with a heat conducting unit, a first heat dissipating unit connected via a heat pipe, and a second heat dissipating unit that can be movably positioned on the heat conducting plate, allowing for dual thermal dissipation through different cooling modes, including air and liquid cooling, without interfering with each other.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat dissipating unit (air cooling or water cooling) is used, then the device structure is simple, but the heat dissipating efficiency is insufficient for high-speed processors
Solution Approach 1:
The patent combines both air cooling (heat dissipating fin) and water cooling (heat dissipating module with water channel) units into a single integrated heat dissipating device. The heat conducting plate serves as a common base that receives heat from the processor and distributes it to both cooling systems simultaneously, enabling dual-mode heat dissipation that meets the high thermal demands of modern processors while maintaining reasonable structural integration.
Solution Approach 2:
The heat conducting plate performs multiple functions: it acts as a thermal interface between the processor and both cooling systems, serves as a structural support for mounting both heat dissipating fin and heat dissipating module, and provides a common heat distribution platform. This multi-functionality allows a single component to support both cooling modes without requiring separate independent systems.
2Stability of the object's composition
If a conventional locking mode is used to fix the heat dissipating fin, then the structure is stable, but the heat dissipating unit cannot be replaced or switched between cooling modes
Solution Approach 1:
The patent employs a movable connection mechanism between the heat dissipating module and the heat conducting plate, featuring a clamping structure with elastic deformation capability. The clamping component can be elastically deformed to release and reposition the heat dissipating module, allowing it to be movable during installation/removal yet stable during operation. This dynamic connection enables both operational stability and ease of replacement.
Solution Approach 2:
The heat dissipating system is segmented into independent modular components: the heat conducting plate, the heat dissipating fin, and the heat dissipating module with water channel are separate replaceable units. This segmentation allows each component to be independently installed, removed, or replaced without affecting the other cooling system, providing versatility in configuration and maintenance.
3Reliability
If the heat dissipating fin is locked with the circuit board, then the air cooling system is stable, but the water cooling unit cannot be installed without detaching the air cooling unit
Solution Approach 1:
Both the air cooling heat dissipating fin and the water cooling heat dissipating module are mounted on the same heat conducting plate rather than being separately fixed to the circuit board. This merged mounting approach allows both cooling units to coexist on a common platform, enabling independent installation and removal of either unit without interfering with the other's attachment to the circuit board.
Solution Approach 2:
The heat conducting plate serves as an intermediary component between the circuit board and both heat dissipating units. It provides a shared mounting interface that decouples the attachment of cooling units from direct circuit board fixation, allowing users to install or remove either cooling unit by interacting only with the heat conducting plate without needing to detach the other unit from the circuit board.
4Device complexity
If only one heat dissipating unit is used at a time, then the device structure is simple, but the thermal dissipation capacity is insufficient for high-speed processors
Solution Approach 1:
The patent merges both air cooling and water cooling systems into a single integrated heat dissipating device where both cooling modes operate simultaneously. The heat conducting plate distributes heat to both heat dissipating fin and heat dissipating module concurrently, enabling combined thermal dissipation capacity that exceeds what either system could achieve alone, while maintaining a unified rather than dual separate structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual thermal dissipation module effectively addresses the inefficiencies of single cooling systems by enabling efficient heat transfer through both air and liquid cooling modes, satisfying the thermal demands of high-speed processors and allowing for convenient switching without component waste.
Implementation Method 1
a first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe
Implementation Method 2
A first surface of the heat conducting plate contacts the thermal source
Data Source
AI summary
An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.