Dual-Mode Memory Chip for Hierarchical Interleaved Configurations

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Solution Overview

Problem

Standardized memory modules optimized for low-end systems may be inefficient when used in larger systems, leading to potential losses in efficiency and increased costs due to the need for custom designs to meet different system requirements.

Innovation Solution

A dual-mode memory chip design that supports both daisy-chained and hierarchical interleaved configurations, allowing for the use of standardized memory modules in a broad range of systems while reducing bus operations and power consumption by configuring memory chips in clusters supported by hubs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If standardized memory modules are used in larger systems, then cost is reduced and manufacturing is simplified, but system efficiency and performance deteriorate

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidsystem efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The memory chip incorporates a mode register that can be programmed to change the operational mode of the chip at runtime. This allows the same standardized chip to dynamically adapt its behavior (daisy-chain vs. hierarchical interleaved mode) to match system requirements, thereby maintaining both manufacturing simplicity and system efficiency

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention changes the operational parameters of the memory chip by allowing configuration of the mode register with different values. This parameter change enables the chip to switch between different operational modes, optimizing performance for different system types without requiring custom hardware designs

Inventive Principle:
Principle #35Parameter changes

2Productivity

If custom memory chip designs are used to meet different system requirements, then system efficiency is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvesystem efficiencyVSAvoiddesign complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The memory chip is designed with universal multi-functionality through the mode register mechanism. A single chip design can serve multiple system types (low-end with daisy-chain configuration and high-end with hierarchical interleaved configuration) by changing its operational mode, eliminating the need for custom designs while maintaining system efficiency

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The dynamic reconfigurability via mode register allows the chip to adapt to different system requirements without requiring multiple static designs. This reduces design complexity by consolidating multiple custom designs into a single flexible architecture

Inventive Principle:
Principle #15Dynamics

3Ease of operation

If daisy-chained configuration is used, then ease of implementation is improved, but memory capacity and bandwidth are limited

Engineering Contradiction:
Improveimplementation easeVSAvoidmemory capacity
Core Design Contradiction:
Ease of operationVSQuantity of substance

Solution Approach 1:

The memory chip can dynamically switch between daisy-chain mode (easier implementation) and hierarchical interleaved mode (higher capacity and bandwidth) based on system requirements. This allows the system to optimize for either ease of implementation or memory capacity depending on the operational context

Inventive Principle:
Principle #15Dynamics

4Loss of energy

If standardized memory modules are used, then cost is reduced, but power consumption increases due to inefficient bus operations

Engineering Contradiction:
Improvepower consumptionVSAvoidstandardization benefit
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

By changing the operational mode parameter of the memory chip, the system can optimize bus operation efficiency. The hierarchical interleaved mode reduces unnecessary bus operations and improves memory access patterns, thereby reducing power consumption while maintaining the benefits of standardized modules

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8037258B2Structure for dual-mode memory chip for high capacity memory subsystem
Publication Date: 2011.10.11 LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
  • US8037258B2 patent drawing
  • US8037258B2 patent drawing
  • US8037258B2 patent drawing

AI summary

A design structure is provided for a dual-mode memory chip supporting a first operation mode in which received data access commands contain chip select data to identify the chip addressed by the command, and control logic in the memory chip determines whether the command is addressed to the chip, and a second operation mode in which the received data access command addresses a set of multiple chips. Preferably, the first mode supports a daisy-chained configuration of memory chips. Preferably the second mode supports a hierarchical interleaved memory subsystem, in which each addressable set of chips is configured as a tree, command and write data being propagated down the tree, the number of chips increasing at each succeeding level of the tree.