Dual Mode Portable Cooling System for Processor Thermal Management
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Solution Overview
Problem
Portable information handling systems face limitations in processing capability due to heat management constraints, as they typically rely on air cooling, which restricts processor speed and performance, especially in smaller form factors.
Innovation Solution
A dual-mode cooling system that selectively employs liquid cooling to supplement air cooling, allowing processors to operate at higher speeds when liquid cooling is available, and throttles speeds to prevent overheating when it is not, using a removable liquid cooling device that includes a cold plate, pump, and radiator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If air cooling is used in portable information handling systems, then the system maintains portability and compact housing size, but processor performance is limited due to insufficient heat removal capability
Solution Approach 1:
The patent applies liquid cooling (hydraulic principle) by introducing a fluid circulation system with a cold plate, pump, and radiator to replace or supplement air cooling. The liquid coolant absorbs heat from the processor through the cold plate and dissipates it externally via the radiator, enabling effective heat removal while maintaining compact portable housing dimensions and achieving high processor performance
2Temperature
If liquid cooling is added to portable information handling systems, then heat removal capability and processor performance are enhanced, but device complexity and housing size increase
Solution Approach 1:
The cooling system is segmented into distinct functional modules: a cold plate that contacts the processor, a pump that circulates coolant, and an external radiator for heat dissipation. This modular segmentation allows the liquid cooling components to be added selectively without redesigning the entire system, thereby enhancing heat removal capability while managing device complexity through organized component separation
Solution Approach 2:
The patent moves the radiator component to an external dimension outside the main housing, while the cold plate integrates with the processor internally. This dimensional separation allows the heat dissipation function to be performed externally without significantly increasing the internal housing volume, thus enhancing cooling capability while maintaining compact portable form factor
3Productivity
If processor speed is increased in portable systems, then system performance improves, but heat generation increases beyond what air cooling can remove
Solution Approach 1:
The liquid cooling system uses a fluid circulation mechanism where coolant flows through channels in the cold plate directly contacting the high-speed processor. The liquid absorbs excess heat generated by the processor at high speeds and transports it to an external radiator for dissipation, enabling the processor to operate at high speeds without overheating, thus maintaining high system performance while managing heat generation effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables powerful processors to operate at high speeds with minimal housing size impact, providing enhanced performance and maintaining thermal constraints, while ensuring portability and reduced power consumption.
Implementation Method 1
A cold plate disposed in the housing proximate the thermal transfer device accepts thermal energy from the thermal transfer device
Implementation Method 2
The liquid cooling device liquid removes thermal energy to the environment external to the housing with a pump and radiator disposed external to the housing
Implementation Method 3
The liquid cooling device liquid removes thermal energy to the environment external to the housing with a pump and radiator disposed external to the housing
Implementation Method 4
A cooling fan generates cooling airflow across a thermal transfer device, such as heat sink or heat pipe, to remove thermal energy generated as a by-product of the operation of one or more processing components
Data Source
AI summary
Liquid cooling is selectively enabled at a portable information handling system to provide enhanced processing capabilities when needed or desired. A liquid cooling cold plate conducts thermal energy from a processing component heat pipe or heat sink to a liquid pumped from external to the information handling system housing. The pump operates with power provided from an AC/DC adapter of the information handling system or power provided from an interface with the information handling system, such as a USB port and cable. Alternatively, liquid cooling is included in a cradle to automatically engage with the information handling system is coupled to the cradle.