Dual-Mode RFID Strap With Non-Etched UHF Antenna Coupling
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Solution Overview
Problem
Existing dual-mode RFID devices are costly due to the expensive etching processes required for both HF and UHF antennas, limiting the affordability and efficiency of manufacturing dual-frequency RFID devices.
Innovation Solution
The development of an integrated dual-mode RFID strap with a conductive ring and HF antenna coupled to a RFID chip assembly, which can couple magnetically, conductively, or capacitively with a UHF antenna without physical contact, and the UHF antenna is formed using lower-cost methods like die-cutting or laser-cutting, eliminating the need for etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching process is used for HF and UHF antennas, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent divides the antenna system into two separate frequency systems (HF and UHF) with distinct antenna structures and chip configurations. Each frequency band is independently designed and manufactured, allowing optimization of each segment without compromising the other, thereby maintaining precision while reducing overall manufacturing complexity and cost.
Solution Approach 2:
The RFID device is designed with multi-functionality to operate in both HF and UHF frequency bands simultaneously. By integrating dual-frequency capabilities into a single device architecture with separate antenna systems, the invention achieves universal applicability across different frequency standards without requiring multiple separate devices, thus improving manufacturing efficiency and reducing costs.
2Adaptability or versatility
If dual-mode RFID chip with UHF and HF chips is used, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent employs segmentation by using separate UHF and HF RFID chips instead of a single integrated dual-mode chip. Each chip is dedicated to its specific frequency band, which simplifies the internal architecture of each chip and reduces the overall complexity of the system by avoiding the need for complex frequency switching and integration circuits that would be required in a monolithic dual-mode chip.
Solution Approach 2:
The patent introduces an intermediary component - the dual-frequency antenna system - that mediates between the separate UHF and HF chips and the external electromagnetic environment. This intermediary structure enables both chips to operate independently while being part of a unified RFID device, thereby managing complexity by providing a clear separation of functions with a dedicated interface for each frequency band.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and enables the production of dual-mode RFID devices with improved efficiency and sustainability by using a common substrate for both HF and UHF frequencies, allowing for easy configuration and minimizing material wastage.
Implementation Method 1
the integrated dual-mode RFID strap configured as a reactive strap as described above couples magnetically, conductively, and/or capacitively with the UHF antenna
Implementation Method 2
the integrated dual-mode RFID strap configured as a reactive strap as described above couples magnetically, conductively, and/or capacitively with the UHF antenna
Data Source
AI summary
Dual-mode RFID devices are provided with an integrated dual-mode RFID strap including either a UHF/HF dual-mode RFID chip or the combination of a UHF RFID chip and an HF RFID chip. An HF antenna and a UHF antenna are both coupled to the integrated dual-mode RFID strap, with the UHF antenna being formed by an approach other than etching, such as a cutting or printing operation, thereby reducing the cost to manufacture the device. If a pair of chips is employed, one of the chips may have a greater thickness than the other chip, which allows for the thicker chip to be incorporated into the device after the thinner chip without requiring a minimum separation between the two chips due to the size of a thermode used to secure the chips. Additionally, the first chip may be tested before securing the second chip, thereby limiting the cost of a rejected device.