Dual-Mode Wireless Charging with Near- and Far-Field Power Transfer
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Solution Overview
Problem
Existing wireless power transmission systems are limited to either near-field or far-field applications, lacking flexibility and efficiency in both short-range and long-range energy transfer.
Innovation Solution
A wireless power transfer system integrating both near-field and far-field capabilities, utilizing a coupling device with a resonant inductive coil and an antenna unit, fabricated using CMOS technology, allowing seamless integration with other active/passive device elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a near-field wireless power transmission system is used, then power transfer efficiency is improved, but transmission distance is limited
Solution Approach 1:
The receiver is divided into two separate units: a near-field receiver for short-range high-efficiency power transfer and a far-field receiver for long-range power transfer. This segmentation allows the system to optimize for different transmission distances without compromise.
Solution Approach 2:
The wireless power transmission system is designed to support both near-field and far-field operating modes through a unified transmitter that can communicate with and power either type of receiver. This multi-functionality resolves the contradiction by making the system adaptable to different transmission distance requirements.
2Length of moving object
If a far-field wireless power transmission system is used, then transmission distance is extended, but power transfer efficiency deteriorates
Solution Approach 1:
The receiver is divided into two separate units: a near-field receiver for short-range high-efficiency power transfer and a far-field receiver for long-range power transfer. This segmentation allows the system to optimize for different transmission distances without compromise.
Solution Approach 2:
The system dynamically selects between near-field and far-field operating modes based on the distance between transmitter and receiver. The transmitter can adapt its transmission parameters and the receiver can switch between near-field and far-field reception modes to optimize power transfer efficiency at any given distance.
3Reliability
If separate near-field and far-field systems are used, then each system is optimized for its specific application, but device complexity increases
Solution Approach 1:
Both near-field and far-field receiver capabilities are merged into a single integrated receiver unit. The receiver includes both near-field and far-field receiving elements that can operate independently or together, eliminating the need for separate receiver devices while maintaining application-specific optimization.
Solution Approach 2:
The wireless power transmission system is designed to support both near-field and far-field operating modes through a unified transmitter that can communicate with and power either type of receiver. This multi-functionality resolves the contradiction by making the system adaptable to different transmission distance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and efficient wireless power transfer over various distances, seamlessly integrating with existing CMOS fabrication steps and supporting both near-field and far-field applications.
Implementation Method 1
The near-field receiver includes a resonant inductive coil that is wired to the battery
Implementation Method 2
The far-field receiver includes an antenna unit that is wired to the battery
Data Source
AI summary
A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.


