Thermally Conductive Composition with Dual-Modified Boron Nitride
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Solution Overview
Problem
Existing thermally conductive materials face challenges in achieving adequate adhesiveness to objects, which hinders effective heat dissipation from power semiconductor devices.
Innovation Solution
A composition comprising a surface-modified inorganic substance and a thermosetting compound, where the surface-modified inorganic substance has specific surface modifiers with adsorbent groups and aromatic rings, forming chemical bonds to enhance adhesiveness and strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional surface modifiers (organosilicon-based or organophosphorus-based coupling agents) are used on boron nitride, then thermal conductivity is achieved, but adhesiveness to the adhesive body is insufficient
Solution Approach 1:
The patent uses a composite surface modifier containing both organosilicon-based coupling agent and organophosphorus-based coupling agent on boron nitride particles. This composite modification approach combines the benefits of both coupling agents: organosilicon provides thermal conductivity while organophosphorus enhances adhesiveness to the adhesive body, thereby resolving the contradiction between thermal performance and bonding strength.
Solution Approach 2:
The patent modifies the surface chemistry parameters of boron nitride by introducing specific functional groups through dual coupling agent treatment. By adjusting the types and ratios of coupling agents, the surface properties are optimized to simultaneously achieve adequate adhesiveness and maintain thermal conductivity, resolving the parameter trade-off.
2Temperature
If high filler content is used to improve thermal conductivity, then heat dissipation performance increases, but aggregation of filler particles occurs
Solution Approach 1:
The surface-modified boron nitride particles act as intermediaries between the adhesive matrix and heat transfer path. The coupling agents on the particle surfaces serve as mediators that improve interfacial compatibility, allowing high filler content to be incorporated without aggregation. This enables maintaining both high thermal conductivity and uniform dispersion stability.
Solution Approach 2:
By changing the surface energy parameters and chemical composition of the filler particles through coupling agent modification, the patent prevents aggregation even at high filler contents. The modified surface parameters reduce inter-particle attraction and enhance compatibility with the adhesive matrix, resolving the contradiction between filler concentration and dispersion stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition results in a thermally conductive material with improved adhesiveness and reduced aggregation, effectively promoting heat dissipation from power semiconductor devices.
Implementation Method 1
the surface modifier A and the surface modifier B each independently have one or more adsorbent groups selected from the group consisting of an alkoxysilyl group, an aldehyde group, and a boronic acid group
Implementation Method 2
forming chemical bonds to enhance adhesiveness and strength
Implementation Method 3
a thermosetting compound
Implementation Method 4
a thermally conductive material, which promotes heat dissipation from the power semiconductor device
Data Source
AI summary
The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance. The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2. Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance. Requirement 2: The surface-modified inorganic substance includes a surface-modified inorganic substance A containing the inorganic substance and the surface modifier A adsorbed on the surface of the inorganic substance, and a surface-modified inorganic substance B containing the inorganic substance and the surface modifier B adsorbed on the surface of the inorganic substance.