Dual-Module Sensor Layout for Low-Noise Motion Detection
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Solution Overview
Problem
Existing sensor units require higher accuracy in detecting angular velocities and accelerations, particularly in minimizing centrifugal force errors and reducing noise interference between sensor modules.
Innovation Solution
A sensor unit design featuring a substrate with two sensor modules, each containing angular velocity and acceleration sensors, positioned to overlap in specific quadrants and connected via distinct coupling portions on opposite surfaces, reducing noise and interference through optimized wiring and module placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If two sensor modules are disposed on the substrate to improve SN ratio, then detection accuracy is improved, but noise interference between modules increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration where sensor modules are disposed on both the front and back surfaces of the substrate. This vertical stacking in the Z-direction reduces lateral noise interference while maintaining detection accuracy through the combined signal from multiple modules.
Solution Approach 2:
The patent employs asymmetric positioning of sensor modules in different quadrants of the substrate surfaces. By strategically placing modules in specific quadrants rather than symmetric arrangements, the design minimizes centrifugal force errors and reduces noise interference while maintaining balanced mechanical properties.
2Device complexity
If sensor modules are positioned close together to reduce wiring complexity, then device complexity is reduced, but interference between modules increases
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking on front and back surfaces) to reduce lateral wiring distances. Modules positioned on opposite surfaces can be connected through the substrate with shorter wiring paths, reducing wiring complexity while the vertical separation minimizes electromagnetic interference between modules.
Solution Approach 2:
The substrate serves as an intermediary structure that electrically connects sensor modules on both surfaces. By using the substrate as a common reference plane and electrical pathway, the patent simplifies wiring architecture while the substrate's physical separation between surfaces reduces direct interference between modules.
Data Source
AI summary
A sensor unit includes: a substrate including a first coupling portion disposed on a first surface and a second coupling portion disposed on a second surface; a first sensor module including a first coupled portion that is located on a side close to the first surface and that is coupled to the first coupling portion, a first acceleration sensor, and a first angular velocity sensor; and a second sensor module including a second coupled portion that is located on a side close to the second surface and that is coupled to the second coupling portion, a second acceleration sensor, and a second angular velocity sensor.