Dual Molding Semiconductor Module PCB Design
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Solution Overview
Problem
Conventional image-sensing devices face challenges in reducing size and preventing contamination of photosensitive members due to the placement of electric components on the same side of the circuit board, leading to increased risk of dust exposure and complex alignment issues, which affects device quality and durability.
Innovation Solution
A dual-molding method is employed where electric components are secured on one surface of the printed circuit board (PCB) using a first molding component, and the photosensitive member is secured on the opposite surface using a second molding component, reducing direct exposure and contamination, while allowing for a more compact design by utilizing both sides of the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electric components and photosensitive members are placed on the same side of the PCB, then the device structure is simpler, but the photosensitive members are exposed to dust and contamination risks increase
Solution Approach 1:
The PCB is divided into two functional surfaces: the first surface accommodates electric components while the second surface accommodates photosensitive members. This segmentation separates components with different contamination risks, allowing the photosensitive members on the second surface to be protected from dust exposure while maintaining a relatively simple overall device structure.
2Device complexity
If all components are mounted on one side of the PCB, then the alignment process is simpler, but the device size cannot be reduced further
Solution Approach 1:
The invention transitions from a two-dimensional component arrangement (all components on one side) to a three-dimensional utilization of the PCB (components distributed on both sides). By mounting electric components on the first surface and photosensitive members on the second surface, the device achieves compact size reduction while maintaining manageable alignment through standardized mounting processes on each surface.
3Ease of manufacture
If photosensitive members are exposed to the environment, then the manufacturing process is simpler, but the quality and durability of the device decreases
Solution Approach 1:
The photosensitive members are mounted on the second surface of the PCB before final assembly, creating a protected environment that reduces exposure to dust and contamination during subsequent manufacturing steps. This preliminary positioning allows for controlled assembly while maintaining manufacturing efficiency, thereby improving device quality without significantly complicating the manufacturing process.
4Volume of moving object
If components are densely packed on one side of the PCB, then the device is more compact, but the alignment precision and assembly quality deteriorates
Solution Approach 1:
By segmenting the component layout across both surfaces of the PCB, the invention achieves compact device volume without overcrowding any single surface. The first surface contains electric components while the second surface contains photosensitive members, allowing each surface to have adequate space for precise alignment and assembly quality while maintaining overall device compactness.
Data Source
AI summary
A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.