Dual Motion Table Die Bonder for Submicron Placement Accuracy
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Solution Overview
Problem
Existing die bond head apparatuses face challenges in achieving high placement accuracy and speed due to the large distance between the die holder and the motion table, leading to unstable positioning and submicron inaccuracies.
Innovation Solution
A dual motion table arrangement is implemented, where one table moves the die bond head body and a separate table precisely positions the die holder, reducing the distance between the die holder and its motion table, enabling submicron accuracy and faster, more stable positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single motion table is used to control the die bond head body, then the device complexity is reduced, but the manufacturing precision of die placement deteriorates due to the large distance between the die holder and motion table
Solution Approach 1:
The single motion table system is segmented into two independent motion tables: a first motion table for controlling the die bond head body and a second motion table for controlling the die holder. This segmentation allows each motion table to be optimized for its specific function, with the second motion table positioned close to the die holder to achieve submicron placement accuracy while the first motion table handles the overall positioning of the bond head body.
2Device complexity
If the die holder is positioned far from the motion table, then the device structure is simplified, but the stability of positioning deteriorates leading to unstable operation
Solution Approach 1:
The die bond head body acts as an intermediary structure that connects the first motion table (controlling overall bond head position) and the second motion table (controlling die holder position). This intermediary structure allows the second motion table to be mounted on the die bond head body, positioning it close to the die holder and providing stable, precise control while maintaining structural coherence through the die bond head body.
3Device complexity
If a single motion table controls the die bond head body, then the device complexity is reduced, but the speed of die placement deteriorates due to control system limitations
Solution Approach 1:
The control system is segmented into two independent control systems, each driving a separate motion table. The first control system manages the die bond head body positioning while the second control system manages the die holder positioning. This segmentation allows parallel operation and independent optimization of control algorithms, enabling faster and more accurate die placement without overwhelming a single control system.
4Device complexity
If the die holder is positioned far from its motion table, then the device structure is simplified, but the measurement precision of die position deteriorates to above submicron level
Solution Approach 1:
The die bond head body serves as an intermediary that mounts the second motion table in close proximity to the die holder. This arrangement minimizes the distance between the second motion table and the die holder, enabling submicron positioning accuracy through reduced mechanical leverage effects and improved control resolution, while the die bond head body maintains structural integrity and connects both motion tables.
Data Source
AI summary
A die bond head apparatus has a die bond head body coupled to a die bond head motion table, a die holder motion table mounted on the die bond head body and a die holder which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table.