Dual Network Electrical Connections in Support Wafer

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Solution Overview

Problem

Existing electronic devices face challenges in reducing impedance breaks in electrical connections, particularly for high-frequency signals, which leads to electrical losses and disturbances due to the limitations in current electrical connection networks within support wafers and encapsulating blocks.

Innovation Solution

The implementation of a dual network of electrical connections within the support wafer, comprising a first network for power supply and a second network of metallic tracks for signal exchange, with specific configurations to minimize impedance breaks, including recesses and external contact zones, and the use of encapsulating blocks to encase the chip and support wafer, ensuring direct and reduced signal pathways.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single network of electrical connections is used in the support wafer, then the structure is simple, but impedance breaks occur causing electrical losses and disturbances

Engineering Contradiction:

Improvesignal transmission qualityVSAvoidelectrical connection network structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The electrical connection network is segmented into two distinct networks: a first network with through-wafer connections for power supply, and a second network with track-based connections for signal exchange. This segmentation allows each network to be optimized for its specific function, reducing impedance breaks for signals while maintaining structural simplicity through functional separation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the support wafer are assigned different connection types: the first network provides vertical through-wafer connections at specific contact locations, while the second network provides lateral track-based connections in other regions. This local differentiation optimizes each area for its specific electrical connection needs, reducing overall impedance breaks.

Inventive Principle:

Principle #3Local quality

2Reliability

If electrical connections are made through the encapsulating block, then connectivity is achieved, but impedance breaks increase causing electrical losses

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidelectrical losses

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The signal exchange connections are extracted from the encapsulating block and relocated to the support wafer's second network. By taking out the signal connections from the encapsulating block material, the patent eliminates the impedance breaks that would occur when signals pass through the encapsulating block, thereby reducing electrical losses.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The support wafer acts as an intermediary structure that provides dedicated signal exchange pathways through its second network of tracks. Instead of forcing signals through the encapsulating block, the support wafer's track network serves as an intermediate transmission medium with lower impedance, reducing electrical losses.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If electrical connection elements are used between chip contacts and support wafer contacts, then electrical connectivity is established, but the number of components and complexity increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidnumber of electrical connection elements

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The support wafer combines multiple connection functions into a single integrated structure. The first network handles power supply connections while the second network handles signal exchange connections, merging what would otherwise require separate connection elements and structures into one unified support wafer system.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10811349B2Electronic device including at least one electronic chip and electronic package

Publication Date: 2020.10.20 STMICROELECTRONICS INT NV

AI summary

An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.