Dual Nozzle Developer Spacing for Hydrophobic Wafer Uniformity
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Solution Overview
Problem
Conventional developing devices face challenges in uniformly developing hydrophobic substrates due to developer splattering, which is exacerbated by high hydrophobicity and the collision of developer and rinse liquids, leading to incomplete contact and particle formation.
Innovation Solution
A developing device with a dual-nozzle system where a first nozzle supplies the developer and a second nozzle, spaced apart, provides a flow-restriction liquid to prevent splattering by forming a liquid film on the substrate, ensuring uniform contact even on high hydrophobic surfaces, with the nozzles positioned to optimize the distance between their supply ports to prevent collision and promote even spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle supplies developer onto the substrate, then the structure is simple, but developer splattering occurs on hydrophobic surfaces leading to poor uniformity
Solution Approach 1:
The single nozzle is divided into two separate nozzles: a first nozzle for supplying developer and a second nozzle for supplying flow-restriction liquid. This segmentation allows each nozzle to perform its specific function independently, preventing splattering while maintaining uniform developer contact on hydrophobic substrates.
Solution Approach 2:
A flow-restriction liquid is introduced as an intermediary substance between the developer and the hydrophobic substrate surface. This intermediary prevents direct splattering of developer while allowing controlled flow to ensure uniform contact, effectively mediating the interaction between developer and substrate.
2Productivity
If developer and rinse liquid are supplied simultaneously from close nozzles, then the process is efficient, but collision between liquids causes splattering and particle formation
Solution Approach 1:
The nozzle system implements different spatial positions for different functions: the first nozzle is positioned for developer supply while the second nozzle is positioned for flow-restriction liquid supply. This local differentiation in nozzle positioning prevents liquid collision at critical areas while maintaining overall process efficiency.
Solution Approach 2:
The flow-restriction liquid is supplied in advance or simultaneously with the developer in a controlled manner to pre-establish a protective layer on the substrate surface. This preliminary action prevents subsequent splattering when developer contacts the hydrophobic surface, eliminating particle formation while maintaining efficiency.
3Volume of moving object
If the distance between nozzles is small, then the device structure is compact, but liquid collision causes splattering
Solution Approach 1:
Instead of increasing the distance between nozzles in a single dimension, the system utilizes multiple dimensions for nozzle positioning. The nozzles are arranged in a three-dimensional configuration that optimizes both compactness and splattering prevention, allowing sufficient separation to prevent collision while maintaining a compact overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-nozzle system effectively suppresses developer splattering and ensures uniform contact with the substrate, preventing particle formation and maintaining substrate wetness to reduce hydrophobicity, allowing for efficient development even on highly hydrophobic surfaces.
Implementation Method 1
the developer may splatter due to a surface tension of the water on the surface of the wafer
Implementation Method 2
a substrate holder that holds a horizontally-oriented wafer rotates around a vertical axis
Implementation Method 3
the surface of the wafer has become more hydrophobic (water-repellent)
Data Source
AI summary
A developer nozzle supplies a developer onto the surface of a substrate rotating around a vertical axis, while a pure water nozzle supplies pure water onto the surface of the rotating substrate. The pure water nozzle is spaced apart from the developer nozzle and located on an outer side of the substrate with respect to the developer nozzle. The pure water restricts flow of the developer on the substrate and causes the developer to spread toward a clockwise side of the substrate when the substrate rotates in a clockwise direction. A liquid film containing the developer and the pure water is formed on the substrate. The developer nozzle and the pure water nozzle are spaced apart from each other to suppress splattering of the developer and the pure water due to collision of the developer with the pure water.