Dual Nozzle Arm Substrate Processing for Oxide Removal
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Solution Overview
Problem
Existing substrate processing technologies face challenges in efficiently removing oxide layers from substrates without causing excessive delays or surface drying, which can lead to pattern collapse in semiconductor devices.
Innovation Solution
A substrate processing apparatus with two engaging nozzle arms, one with a stepwise shape, allows for simultaneous and rapid spraying of deionized water and organic solvent onto the substrate's center region, followed by a chemical solution, to effectively remove oxide layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single nozzle arm is used to spray processing solutions, then the device structure is simple, but the processing speed is slow and causes excessive delay
Solution Approach 1:
The patent combines two nozzle arms into a single integrated structure where the second nozzle arm is mounted on the first nozzle arm. This merging allows both nozzles to operate simultaneously from different positions and angles, doubling the processing capacity while maintaining a compact unified structure that doesn't excessively increase device complexity.
Solution Approach 2:
The patent introduces spatial dimensionality by positioning nozzles at different locations and angles. The first nozzle arm sprays from a horizontal position while the second nozzle arm sprays from a vertical position, creating multi-dimensional coverage that accelerates processing without requiring proportional increases in device complexity.
2Reliability
If deionized water is sprayed first to remove oxide layers, then the oxide layer removal is effective, but surface drying occurs causing pattern collapse
Solution Approach 1:
The patent applies preliminary action by spraying organic solvent onto the substrate surface before spraying deionized water. The organic solvent pre-wets the surface and modifies surface tension, preventing the water from causing excessive surface drying and pattern collapse while still allowing effective oxide layer removal.
Solution Approach 2:
The organic solvent acts as an intermediary substance between the deionized water and the substrate surface. It mediates the interaction by reducing surface tension and preventing direct harmful effects of water on the patterned surface, while still enabling the water to effectively remove oxide layers.
3Productivity
If chemical solution is sprayed directly onto the substrate, then the oxide layer removal is direct, but the reaction efficiency is low without pre-wetting
Solution Approach 1:
The patent uses preliminary action by spraying organic solvent before the chemical solution. This pre-wetting modifies the substrate surface properties, enhancing the subsequent chemical reaction efficiency and reducing the time required for effective oxide layer removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient removal of oxide layers without excessive delay, preventing pattern collapse and ensuring effective processing of substrates by reducing surface tension and facilitating drying through rotating methods or supercritical fluids.
Implementation Method 1
spraying, from a first nozzle, organic solvent onto a stage of the substrate processing apparatus
Implementation Method 2
spraying, from a second nozzle, DI water toward a center region of the stage
Implementation Method 3
spraying, from a third nozzle, a chemical solution
Implementation Method 4
a rotation driving portion configured to rotate the stage around a first axis extending in a vertical direction
Data Source
AI summary
A substrate processing apparatus includes a stage configured to support a substrate, a rotation driving portion configured to rotate the stage around a first axis extending in a vertical direction, a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis, and a second nozzle arm disposed on the stage and configured to rotate around a third axis parallel to the second axis. The first nozzle arm includes a first nozzle supporting member extended parallel to the stage, a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape, and a first nozzle coupled to the first connection member and configured to spray a fluidic material.