Dual Nozzle Plating Apparatus for Uniform Copper Deposition
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Solution Overview
Problem
The plating process using electroless plating liquid on copper wiring substrates faces temperature discrepancies across the substrate, leading to varying reaction conditions from the central to the peripheral portions, affecting the uniformity of the plating process.
Innovation Solution
A plating apparatus with a dual-nozzle system, where the first nozzle supplies a higher-temperature plating liquid directly to the central region and the second nozzle, positioned closer to the central portion, supplies a lower-temperature plating liquid, ensuring uniform temperature distribution by mixing at the substrate's peripheral region, thus maintaining consistent reaction conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single nozzle supplies plating liquid to the substrate while rotating, then the device complexity is low, but the temperature uniformity across the substrate deteriorates
Solution Approach 1:
The single nozzle is divided into multiple nozzles (first nozzle and second nozzle) positioned at different locations. The first nozzle is positioned closer to the peripheral portion while the second nozzle is positioned closer to the central portion, allowing independent temperature control for different substrate regions
Solution Approach 2:
Different nozzles supply plating liquid at different temperatures according to the local requirements of substrate regions. The first nozzle supplies higher temperature plating liquid to the peripheral portion while the second nozzle supplies lower temperature plating liquid to the central portion, achieving local temperature optimization
2Manufacturing precision
If plating liquid flows from central portion to peripheral portion during substrate rotation, then the plating process covers the entire substrate surface, but the reaction condition uniformity deteriorates due to temperature decrease
Solution Approach 1:
The plating liquid temperature is adjusted in advance before reaching different substrate regions. The first nozzle pre-heats the plating liquid to a higher temperature before it reaches the peripheral portion, compensating for the temperature drop that would occur during flow from the central portion
Solution Approach 2:
The temperature parameter of the plating liquid is changed according to the substrate position. By controlling the first nozzle to supply higher temperature plating liquid and the second nozzle to supply lower temperature plating liquid, the reaction condition consistency is maintained across different substrate regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a uniform plating process by maintaining consistent reaction conditions across the substrate, enhancing the uniformity of the Co plating layer thickness and stability of the electron transfer layer, reducing the impact on the substrate and promoting efficient plating film growth.
Implementation Method 1
a first nozzle 40 having a discharge opening through which the plating liquid is discharged toward the substrate, and a second nozzle 45 having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle 40. Furthermore, a plating liquid supplying device 30 configured to set a temperature of the plating liquid supplied to the first nozzle 40 to be higher than a temperature of the plating liquid supplied to the second nozzle 45
Data Source
AI summary
A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.