Dual Nozzle Substrate Processing Apparatus Splash Suppression
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Solution Overview
Problem
Existing substrate processing technologies face challenges in suppressing the generation of splashes and etching residues when using a combination of continuous and jet flows of processing solutions, particularly due to collisions between the liquid films formed by these flows on rotating substrates, which can lead to defects and uneven processing.
Innovation Solution
A substrate processing apparatus and method that involves a rotating holder, a first nozzle for generating a jet flow of droplets, and a second nozzle for discharging a continuous flow, with a nozzle moving unit that adjusts the positional relationship and movement paths of the nozzles to ensure the jet flow passes through the substrate's rotation center and the continuous flow's landing position is closer to the center than the jet flow's, tilting the continuous flow's direction to increase the distance between the two flows, thereby reducing collisions and stirring the processing solution effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the first nozzle and second nozzle are positioned close to each other to efficiently process the substrate, then the processing efficiency is improved, but the liquid films formed by the two nozzles collide on the substrate causing splashes and etching residues
Solution Approach 1:
The patent introduces a temporal dimension to the spatial arrangement of liquid films by making their movement paths different. The first nozzle moves along a first movement path while the second nozzle moves along a second movement path, ensuring they never occupy the same position on the substrate simultaneously. This dimensional separation in the time-space domain prevents collision while maintaining close proximity for efficient processing.
Solution Approach 2:
The patent employs dynamic movement paths for the nozzles rather than fixed positions. The first nozzle and second nozzle move along different trajectories that are coordinated to avoid intersection points on the substrate. This dynamic approach allows the nozzles to maintain optimal processing proximity while continuously adjusting their positions to prevent liquid film collision.
2Productivity
If the nozzles are scanned integrally to reduce processing time, then the productivity is improved, but the positional control complexity increases
Solution Approach 1:
The patent divides the nozzle system into two independently controllable units: the first nozzle and the second nozzle. Each nozzle can be controlled separately along its own movement path, allowing independent optimization of their trajectories. This segmentation simplifies the control problem by treating it as two separate one-dimensional motion control tasks rather than one complex two-dimensional coordinated control task.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the generation of splashes and etching residues, ensures uniform processing across the substrate, and maintains the temperature consistency, thereby improving the processing efficiency and reducing defects.
Implementation Method 1
mix a processing solution and pressurized gas to generate a jet flow of droplets of the processing solution, and to eject the generated jet flow of droplets onto the substrate
Implementation Method 2
a rotating holder that rotates a substrate while holding the substrate horizontally
Data Source
AI summary
A substrate processing apparatus includes a rotating holder for a substrate, a first nozzle used to eject a jet flow, a second nozzle used to discharge a continuous flow, and a nozzle moving unit integrally moving the first and second nozzles. A landing position of the continuous flow is located closer to a rotation center than a landing position of the jet flow is. At least movement paths of the landing positions of the jet flow and the continuous flow or flow directions of the continuous flow and the jet flow are different from each other. The movement paths are made to be different from each other by locating the landing position of the continuous flow downstream of the movement path of the landing position of the jet flow. The flow directions are made to be different from each other by tilting the continuous flow.