Dual-Nozzle Spin Cleaning for Uniform Substrate Drying
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Solution Overview
Problem
Conventional spin-type wet cleaning methods in semiconductor manufacturing face issues such as the IPA drop phenomenon, leading to static electricity and defects on substrates, and limited drying range and chemical liquid supply height, resulting in non-uniform drying and contamination.
Innovation Solution
A substrate processing apparatus with independently controlled nozzles for liquid and gas supply, allowing for separate movement and positioning of a chemical liquid nozzle and an inert gas nozzle, which can be moved closer to the substrate center to expand drying range and prevent chemical liquid scattering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an integrated nozzle is used for both chemical liquid supply and drying gas supply, then device complexity is reduced, but the chemical liquid supply nozzle must wait above the substrate during drying process causing IPA drop phenomenon and substrate defects
Solution Approach 1:
The integrated nozzle is divided into separate nozzles: a chemical liquid supply nozzle and a drying gas supply nozzle. Each nozzle is independently controlled and can move separately, allowing the chemical liquid supply nozzle to move away from the substrate during drying process while the drying gas supply nozzle remains positioned for effective drying.
2Area of stationary object
If the integrated nozzle is moved to the opposite edge area for drying, then drying range is improved, but the chemical liquid supply nozzle collides with the cup unit causing drying defects
Solution Approach 1:
By separating the nozzles, the drying gas supply nozzle can be independently moved to the opposite edge area of the substrate to expand drying range, while the chemical liquid supply nozzle remains positioned away from the cup unit, preventing collision and ensuring uniform drying without defects.
3Object-affected harmful factors
If the gas supply nozzle outlet is formed smaller than the chemical liquid supply nozzle outlet, then chemical liquid scattering is prevented, but the usable flow rate in terms of inertia is limited
Solution Approach 1:
The separate nozzle configuration allows each nozzle to have optimized outlet dimensions independent of the other. The chemical liquid supply nozzle can have a smaller outlet to prevent scattering, while the drying gas supply nozzle can have a larger outlet to provide sufficient inert gas flow rate and inertia for effective drying.
4Device complexity
If the chemical liquid supply height is limited, then the integrated nozzle structure is simplified, but the gas supply nozzle cannot be moved beyond the height limit reducing drying effectiveness
Solution Approach 1:
The separate nozzle design allows the drying gas supply nozzle to have an extended height range independent of the chemical liquid supply nozzle. This enables the drying gas supply nozzle to reach positions beyond the limited height of the chemical liquid supply nozzle, improving drying effectiveness and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents defects caused by the IPA drop phenomenon, enhances drying performance by expanding the drying range, and ensures uniform drying across the substrate, improving the overall quality of the liquid processing process.
Implementation Method 1
a first nozzle (392) configured to eject a cleaning liquid onto a substrate W
Implementation Method 2
a second nozzle (394) configured to eject an inert gas onto the substrate W to dry the substrate W
Data Source
AI summary
A substrate processing method for processing a substrate, the substrate processing method comprising: a first nozzle moving step of moving a first nozzle to a process position and a standby position in a swing motion manner; a cleaning liquid supplying step of supplying, by the first nozzle, a cleaning liquid onto a rotating substrate at the process position of the first nozzle; a second nozzle moving step of moving a second nozzle to a process position and a standby position in a swing motion manner; a drying gas supplying step of supplying, by the second nozzle, a drying gas onto the rotating substrate at the process position of the second nozzle; and a nozzle distance controlling step of controlling a distance between the first nozzle and the second nozzle on the basis of a horizontal position of at least one of the first nozzle and the second nozzle.