Dual Nozzle Substrate Treatment for Edge Etching and Center Protection
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Solution Overview
Problem
The etching process on substrates, particularly in semiconductor and liquid crystal display device fabrication, faces challenges with non-uniformity and damage due to the spread of etching solutions, leading to over-etched regions and pattern damage when the center region is dried or etched during edge region processing.
Innovation Solution
A substrate treating apparatus and method that uses two types of solutions: an etching solution for the edge region and an etch prevention solution (EPS) for the center region, supplied through dedicated nozzles on a supporting arm system, ensuring the center region remains wet and unetched by maintaining a continuous EPS supply during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching solution is supplied on the edge region of the substrate, then the edge region can be etched, but the center region may be dried and damaged patterns may be formed
Solution Approach 1:
The substrate surface is segmented into two distinct regions: the edge region that receives etching solution and the center region that receives etch prevention solution. This spatial segmentation allows simultaneous etching of the edge region while protecting the center region from drying and damage.
Solution Approach 2:
Different regions of the substrate are given different properties through selective solution application. The edge region has etching capability while the center region has etch prevention capability. This local differentiation resolves the contradiction by allowing etching where needed while preventing damage where protection is required.
2Manufacturing precision
If etching solution is supplied on the edge region of the substrate, then the edge region can be etched, but the etching solution may be scattered toward the center region causing process failure
Solution Approach 1:
The etch prevention solution acts as an intermediary barrier between the etching solution and the center region. It prevents the etching solution from scattering onto the center region, thereby maintaining process reliability while allowing controlled etching at the edge region.
3Manufacturing precision
If multiple treatment solutions are supplied simultaneously, then uniform etching can be maintained, but the device complexity increases
Solution Approach 1:
Multiple solution supplying nozzles are merged onto a single rotating arm structure. This integration allows simultaneous supply of etching and etch prevention solutions while minimizing the increase in device complexity through shared mechanical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the center region of the substrate from drying or being etched, thereby maintaining process uniformity and preventing pattern damage, ensuring successful substrate treatment.
Implementation Method 1
Owing to a centrifugal force, the etching solution supplied on the center region of the substrate is spread on the entire region of the substrate
Data Source
AI summary
In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.