Dual-Nozzle Ultrasonic Substrate Cleaning with Microbubbles
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Solution Overview
Problem
Existing substrate cleaning devices using ultrasonic cleaning solutions lack high detergency, failing to effectively remove contaminants from substrates, particularly on edges and bevels.
Innovation Solution
A substrate cleaning device with a rotating mechanism and dual nozzles that eject ultrasonic cleaning solutions with varying frequencies, powers, flow rates, and types, ensuring thorough cleaning by mixing or targeting different surfaces, including edges and bevels, while a microbubble supply mechanism with a filter enhances cleaning efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle is used to eject ultrasonic cleaning solution, then the device structure is simple, but the detergency is insufficient and contaminants on edges and bevels cannot be effectively removed
Solution Approach 1:
The cleaning device is segmented into multiple nozzles (first nozzle and second nozzle) that eject ultrasonic cleaning solutions with different frequencies onto different regions of the substrate. This segmentation allows each nozzle to target specific areas (e.g., center vs. edges, front surface vs. back surface) to comprehensively remove contaminants that a single nozzle cannot address effectively.
Solution Approach 2:
Different nozzles are configured with different ultrasonic frequencies and ejection positions to provide localized cleaning quality matched to specific substrate regions. For example, higher frequencies may be used for delicate areas while lower frequencies target tougher contaminants on edges, ensuring optimal cleaning effectiveness for each local region.
2Manufacturing precision
If ultrasonic cleaning solution is ejected without microbubbles, then the device structure is simple, but the cleaning efficacy is insufficient
Solution Approach 1:
Microbubbles are introduced as an intermediary substance into the ultrasonic cleaning solution. These microbubbles enhance the cleaning efficacy by improving the penetration and cavitation effects of the ultrasonic waves, allowing for more effective removal of contaminants while the filter removes excess microbubbles to prevent contamination.
3Manufacturing precision
If ultrasonic cleaning solution is ejected at high flow rate, then cleaning coverage is improved, but pattern collapse may occur
Solution Approach 1:
The cleaning process uses periodic ultrasonic waves with different frequencies to create controlled cavitation cycles. This periodic action provides sufficient cleaning coverage through repeated implosion cycles while controlling the peak forces to prevent pattern collapse, unlike continuous high-flow ejection that applies constant excessive force.
Solution Approach 2:
Different ultrasonic frequencies are used to change the physical parameters of the cleaning action. By adjusting frequency rather than simply increasing flow rate, the system achieves comprehensive cleaning coverage while maintaining controlled energy levels that prevent damage to delicate substrate patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved detergency by effectively removing contaminants from all surfaces, including edges and bevels, with the dual-nozzle system and microbubble technology, ensuring comprehensive cleaning without pattern collapse or contamination.
Implementation Method 1
a transducer that applies ultrasonic waves to the cleaning fluid supplied from the flow path
Implementation Method 2
ejecting an ultrasonic cleaning solution from a first nozzle and a second nozzle held in one casing toward a predetermined surface of a substrate
Implementation Method 3
a microbubble supply mechanism that is connected to the flow path and introduces microbubbles into the cleaning fluid
Data Source
AI summary
Providing a substrate cleaning device and a substrate cleaning method having high detergency. Provided is a substrate cleaning device including: a substrate rotating mechanism that rotates a substrate; and a first nozzle and a second nozzle that eject an ultrasonic cleaning solution toward a predetermined surface of the substrate that is rotated, wherein the first nozzle and the second nozzle are held in one casing.