Dual Nozzle Substrate Treating Apparatus for Uniform Chemical Distribution
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Solution Overview
Problem
Current substrate treating processes, particularly in semiconductor manufacturing, face inefficiencies in uniformly treating the inside and outside of substrates and in reducing chemical consumption, with existing methods often leading to uneven coverage and excessive chemical use.
Innovation Solution
A substrate treating apparatus and method utilizing a spin head with dual ejection members, where a first nozzle discharges a chemical inside the substrate's radius and a second nozzle, with higher concentration and temperature, discharges a second chemical outside the radius, ensuring uniform treatment and reducing chemical usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle discharges chemical to the substrate, then the device complexity is low, but the uniformity of treatment across the substrate surface deteriorates
Solution Approach 1:
The single nozzle is divided into multiple nozzles (first nozzle and second nozzle) positioned at different locations. The first nozzle discharges chemical toward the center region while the second nozzle discharges chemical toward the outer region, ensuring uniform coverage across the entire substrate surface including both inside and outside areas.
Solution Approach 2:
Different regions of the substrate receive chemically treated solutions with optimized properties. The first nozzle targets the center region with appropriate chemical concentration and temperature, while the second nozzle targets the outer region with higher concentration and temperature to enhance reactivity and uniformity in that specific area.
2Manufacturing precision
If chemical is discharged to cover the entire substrate, then the uniformity of treatment improves, but the amount of chemical consumed increases
Solution Approach 1:
The chemical discharge is optimized for each region. The second nozzle discharges chemical with higher concentration and temperature specifically to the outer region, enhancing reactivity and treatment effectiveness in that area, thereby reducing the total volume of chemical needed while maintaining uniform treatment across the substrate.
Solution Approach 2:
The concentration and temperature parameters of the discharged chemical are varied by region. The second nozzle delivers chemical with higher concentration and temperature to the outer region, improving reactivity and treatment uniformity while minimizing the total amount of chemical consumed through optimized parameter distribution.
3Productivity
If chemical with higher concentration and temperature is used, then the reactivity and treatment efficiency improve, but the complexity of the chemical supply system increases
Solution Approach 1:
The chemical supply system provides different concentration and temperature levels to different regions based on treatment requirements. The second nozzle supplies chemical with higher concentration and temperature to the outer region to enhance reactivity and treatment efficiency, while the first nozzle supplies chemical with standard parameters to the center region, optimizing overall treatment effectiveness.
Solution Approach 2:
The chemical supply system incorporates variable parameters including concentration and temperature control for different nozzles. The second nozzle is configured to discharge chemical with higher concentration and temperature to improve reactivity and treatment efficiency in the outer region, demonstrating parameter optimization to enhance productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves efficient and uniform treatment of substrates by optimizing chemical distribution with higher centrifugal force and reactivity, improving treatment quality and reducing chemical consumption.
Implementation Method 1
spreading the chemical or the deionized water to the entire surface of the substrate by using a centrifugal force
Implementation Method 2
a first ejection member having a first nozzle configured to discharge a first chemical to the substrate located in the spin head
Implementation Method 3
a second ejection member having a second nozzle configured to discharge a second chemical of the same chemical composition as that of the first chemical to the substrate located in the spin head
Data Source
AI summary
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head configured to support the substrate, a cup surrounding an outer circumference of the spin head, a first ejection member having a first nozzle configured to discharge a first chemical to the substrate located in the spin head, and a second ejection member having a second nozzle configured to discharge a second chemical of the same chemical composition as that of the first chemical to the substrate located in the spin head.