Dual Nozzle Substrate Liquid Treatment for Thermal Uniformity
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Solution Overview
Problem
In semiconductor fabrication, the polymer removing liquid treatment process faces challenges in achieving uniform thermal conditions and preventing polymer re-adhesion due to the disturbance of treatment liquid flow between nozzles, leading to exposure of the substrate's central portion to the atmosphere and particle generation.
Innovation Solution
A substrate liquid treatment apparatus with two nozzles that alternately supply and move treatment liquid, ensuring continuous coverage of the substrate's central portion while preventing the treatment liquid from the peripheral nozzle from disturbing the flow towards the central portion, thus maintaining uniformity and preventing re-adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the scan discharge method is used to move the nozzle between central and peripheral portions, then in-plane uniformity of thermal condition is improved, but the central portion of the substrate is exposed to the substrate surrounding atmosphere causing particle generation
Solution Approach 1:
The patent divides the single nozzle into two separate nozzles (first nozzle and second nozzle) that can operate independently. This segmentation allows one nozzle to continuously supply treatment liquid to the central portion while the other nozzle moves to scan the peripheral portions, thereby maintaining continuous coverage and preventing exposure to the surrounding atmosphere while achieving uniform thermal conditions.
Solution Approach 2:
The first nozzle is positioned to supply treatment liquid to the central portion of the substrate before the second nozzle arrives at the peripheral portions. This preliminary action ensures that the central portion is already covered with treatment liquid when the scanning nozzle moves away, preventing exposure and particle generation.
2Manufacturing precision
If two nozzles are mounted to one nozzle arm and move along a circular arc, then the whole surface of the substrate can be treated uniformly and the central portion is prevented from being exposed to the substrate surrounding atmosphere, but the treatment liquid discharged from one nozzle may disturb the flow of treatment liquid from the other nozzle
Solution Approach 1:
The patent separates the two nozzles into independent mounting arrangements, allowing them to be controlled independently. This enables the first nozzle to supply treatment liquid to the central portion while the second nozzle supplies liquid to peripheral portions, preventing flow disturbance while maintaining uniform treatment coverage.
Solution Approach 2:
The patent applies different discharge rates to different nozzles based on their positions. The first nozzle supplies treatment liquid at a first discharge rate to the central portion, while the second nozzle supplies at a second discharge rate to peripheral portions. This local quality approach optimizes liquid flow patterns for each region, preventing disturbance while achieving uniform treatment.
3Temperature
If the substrate rotates at high circumferential speed at the peripheral portion, then the substrate draws heat from the polymer removing liquid faster, but the time required to remove polymer at the peripheral portion is longer than at the central portion
Solution Approach 1:
The patent applies different discharge rates to different regions of the substrate. The second nozzle supplies treatment liquid at a higher discharge rate to the peripheral portions where heat transfer is faster, compensating for the shorter contact time due to high circumferential speed. This ensures uniform polymer removal across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform thermal conditions and efficient polymer removal across the substrate, preventing re-adhesion and particle generation, while maintaining continuous liquid coverage and improving in-plane uniformity of the treatment process.
Implementation Method 1
The substrate draws heat from the polymer removing liquid as it flows from the central portion to the peripheral portion of the substrate
Implementation Method 2
The substrate draws heat from the polymer removing liquid as it flows from the central portion to the peripheral portion of the substrate, so that the temperature of the polymer removing liquid lowers
Data Source
AI summary
A substrate liquid treatment method includes: (a) rotating the substrate about the vertical axis; (b) supplying the treatment liquid to the rotating substrate from the second nozzle with a falling point of the treatment liquid supplied from the second nozzle moving from the central portion to the peripheral portion of the substrate, while supplying the treatment liquid to the central portion of the substrate from the first nozzle, (c) after (b), moving the second nozzle from the peripheral portion to the central portion of the substrate with the supplying of the treatment liquid from the second nozzle being stopped, while continuing supplying the treatment liquid to the central portion of the rotating substrate from the first nozzle; and (d) after (c), supplying the treatment liquid to the rotating substrate from the second nozzle.