Dual Optical Path Edge Exposure Apparatus for High Throughput
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Solution Overview
Problem
The existing edge exposure apparatuses for substrates face challenges in increasing throughput without increasing the size of the apparatus, leading to space constraints and maintenance issues in high-throughput coating and developing processes, particularly in semiconductor wafer processing.
Innovation Solution
The edge exposure apparatus employs a dual optical path system with rotating mounting tables and light guide rods, allowing a common light source to alternately expose the edge portions of substrates on multiple tables, reducing waste and installation space, and incorporating a light blocking mechanism to optimize energy use and processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If additional edge exposure apparatuses are provided to increase throughput, then wafer processing throughput is improved, but apparatus size and heat generation increase
Solution Approach 1:
The patent combines two edge exposure apparatuses into a single integrated unit that processes two wafers simultaneously. The apparatus includes a first exposure unit and a second exposure unit sharing common structural elements and control systems, effectively merging functionality while maintaining compact size.
Solution Approach 2:
The patent transitions from sequential single-wafer processing to parallel dual-wafer processing by adding spatial dimensionality. Two mounting tables are positioned at different locations (one above the other or side by side) to enable simultaneous exposure of two wafers, effectively doubling throughput without proportionally increasing footprint.
2Productivity
If additional edge exposure apparatuses are provided to increase throughput, then wafer processing throughput is improved, but maintenance space and lamp replacement space are insufficient
Solution Approach 1:
The patent integrates two exposure units with shared maintenance access points. The structural design allows technicians to access and maintain components for both exposure units from the same service area, eliminating the need for separate maintenance spaces that would be required for completely independent apparatuses.
Solution Approach 2:
The apparatus incorporates universal maintenance access pathways and shared component racks that serve both exposure units. Lamp replacement mechanisms and optical alignment systems are designed to be accessible from common service positions, making the system easier to maintain despite increased functionality.
3Productivity
If multiple light sources are provided to increase throughput, then processing speed is improved, but heat generation and energy consumption increase
Solution Approach 1:
The patent achieves parallel processing capability through spatial arrangement of two mounting tables and their associated optical paths, rather than relying solely on multiple independent light sources. The system can alternately or simultaneously expose wafers using the same light source or shared light sources, distributing thermal load more effectively.
Solution Approach 2:
The exposure units can operate in alternating periodic cycles, where one unit exposes a wafer while the other prepares or cools down. This periodic operation pattern allows thermal management while maintaining high overall throughput, as the system continuously processes wafers through the two units in sequence or parallel with coordinated timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high processing ability and energy savings while maintaining a compact apparatus size, allowing for increased throughput in coating and developing processes without expanding the apparatus footprint, thus enhancing operational efficiency and reducing contamination risks.
Implementation Method 1
an edge exposure apparatus for exposing an edge portion of a substrate having a photosensitive thin film formed thereon by a light source for exposure
Implementation Method 2
a first mounting table configured to be rotatable about a vertical axis while mounting the substrate thereon
Data Source
AI summary
The present invention includes a first and a second optical path forming member arranged within a path of light beams from a light source; a first mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the first optical path forming member, and a second mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the second optical path forming member, each of the mounting tables being configured to be rotatable about a vertical axis while mounting the substrate thereon; and a light blocking means for blocking application of light from each of the first and second optical path forming members. A common light source can be used to perform edge exposure for the substrates on the first and second mounting tables, for example, at the same time, so that a high processing ability can be offered and an increase in size of the apparatus can be prevented.