Dual-Optical Semiconductor Fault Analysis for Precise Failure Localization
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Solution Overview
Problem
Current semiconductor fault analysis devices lack an effective method for accurately detecting the failure place in semiconductor devices.
Innovation Solution
A semiconductor fault analysis device and method that utilize a dual optical detection system with aligned optical axes to detect light emitted by a semiconductor device after applying a stimulus signal, allowing for precise identification of failure places.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mechanical positioning systems are used to move optical systems relative to the semiconductor device, then the device can perform analysis and marking functions, but positional deviations occur due to mechanical inaccuracies leading to misalignment between analysis and marking processes
Solution Approach 1:
The patent replaces mechanical positioning systems with optical field-based positioning. Two optical systems (first optical system for analysis, second optical system for marking) are optically coupled to the same optical field, eliminating mechanical transmission errors. The optical systems are positioned based on optical field coordinates rather than mechanical stage coordinates, fundamentally substituting mechanical positioning with optical field positioning to achieve sub-micron alignment precision.
Solution Approach 2:
The patent introduces an optical field as an intermediary between the analysis and marking functions. Both optical systems observe and operate on the same optical field, which serves as a common reference frame. This optical field intermediary ensures that the analysis region and marking region are precisely co-located without relying on mechanical positioning accuracy between separate systems.
2Adaptability or versatility
If separate optical systems are used for analysis and marking functions, then both functions can be performed, but maintaining precise positional relationship between the optical axes becomes difficult
Solution Approach 1:
The patent merges the analysis and marking functions into a unified optical platform. Both the first optical system (for analysis) and the second optical system (for marking) are optically coupled to the same optical field and share a common optical reference frame. This merging ensures that the optical axes of both systems are naturally aligned through the common optical field, eliminating alignment errors that would occur with completely separate systems.
Solution Approach 2:
The patent creates a universal optical platform that serves multiple functions. The same optical field and positioning reference are used for both analysis and marking operations, making the system multi-functional while maintaining precise alignment. This universal reference frame allows the system to reliably perform different functions (analysis, marking, verification) without compromising alignment reliability.
3Productivity
If mechanical stages are used to position the semiconductor device, then the device can be analyzed and marked, but mechanical inaccuracies cause positional deviations between analysis and marking
Solution Approach 1:
The patent substitutes mechanical stage positioning with optical field-based positioning. Instead of relying on mechanical stage coordinates to track device position, the system uses optical field coordinates established by the optically coupled systems. This substitution eliminates mechanical transmission errors and achieves sub-micron positioning accuracy through optical reference markers and field-based coordinate transformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables accurate detection of failure places in semiconductor devices by maintaining the positional relationship between the optical axes of the detection systems, reducing deviation between the actual failure place and the marked position.
Implementation Method 1
a first optical detection part receives light emitted by a semiconductor device via a first optical system
Implementation Method 2
a second optical detection part receives light emitted by the semiconductor device via a second optical system
Data Source
AI summary
A control part of a semiconductor fault analysis device outputs an alignment command that moves a chuck to a position at which a target is detectable by a first optical detection part and then aligns an optical axis of a second optical system with an optical axis of a first optical system with the target as a reference, and outputs an analysis command that applies a stimulus signal to a semiconductor device and receives light from the semiconductor device emitted according to a stimulus signal with at least one of a first optical detection part and a second optical detection part in a state in which a positional relationship between the optical axis of the first optical system and the optical axis of the second optical system is maintained.