Dual Output Charge Pump Sharing Flying Capacitance
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Solution Overview
Problem
Traditional parallel supply circuits for DC/DC power conversion in portable devices result in increased die area, input/output complexity, and bill of materials cost due to duplication of components for boost and buck output voltages.
Innovation Solution
A charge pump system that combines a boost charge pump circuit and a buck charge pump circuit sharing a common flying capacitance, utilizing switches to operate in four phases to generate both 2×Vin and Vin/2 output voltages, reducing the need for duplicate passive components and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate boost and buck charge pump circuits are utilized, then both boosted and divided voltage outputs can be delivered, but die area and passive component duplication increase
Solution Approach 1:
The patent combines separate boost and buck charge pump circuits into a single integrated circuit that shares common passive components including flying capacitance, holding capacitance, and switching elements. This merging approach maintains the ability to deliver both boosted (2×Vin) and divided (Vin/2) voltage outputs while significantly reducing die area by eliminating component duplication.
Solution Approach 2:
The integrated charge pump circuit is designed to perform multiple functions using shared components. The same flying capacitance and switching network are utilized for both voltage boosting and voltage division operations, allowing a single circuit structure to serve dual purposes and reduce overall component count.
2Adaptability or versatility
If separate boost and buck charge pump circuits are utilized, then both boosted and divided voltage outputs can be delivered, but I/O complexity and BOM cost increase
Solution Approach 1:
The patent merges separate I/O interfaces into a unified structure where the integrated charge pump shares common control signals and output nodes. This consolidation reduces I/O complexity by eliminating duplicate connection points and simplifying the interface between the charge pump and external circuits.
3Adaptability or versatility
If separate boost and buck charge pump circuits are utilized, then both boosted and divided voltage outputs can be delivered, but passive component duplication increases BOM cost
Solution Approach 1:
The patent combines separate passive components into shared elements. The flying capacitance, holding capacitance, and switching elements are common to both boost and buck operations, eliminating the need for duplicate passive components and reducing bill of materials cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces input/output complexity and bill of materials cost while maintaining efficient voltage conversion, with improved charge preservation and reduced ripple effects.
Implementation Method 1
a charge pump having a boost charge pump circuit and a buck charge pump circuit sharing a common flying capacitance
Data Source
AI summary
According to some implementation, a charge pump includes a boost charge pump circuit and a buck charge pump circuit sharing a common flying capacitance. In some implementations, the boost pump circuit includes an input node and a boosted-voltage output node, and the buck charge pump circuit includes the input node and a divided-voltage output node. In some implementations, the charge pump of claim 3 wherein the boosted-voltage includes 2×Vin, and the divided-voltage includes Vin/2, Vin being an input voltage at the input node. In some implementations, the boost pump circuit further includes a first holding capacitance that couples the boosted-voltage output node to a ground. In some implementations, the buck pump circuit further includes a second holding capacitance that couples the divided-voltage output node to the ground.