Dual-PA RF Module Layout for Compact Multi-Band Thermal Management
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Solution Overview
Problem
Existing radio-frequency modules face challenges in reducing the size of mounting substrates while maintaining efficient power amplification and signal processing for multi-band communication standards like 4G and 5G, which requires compact and efficient design without compromising performance.
Innovation Solution
The design incorporates a radio-frequency module with two power amplifiers mounted on one main surface of a mounting substrate and additional circuit components and external connection terminals on the opposite surface, allowing for shared power supply connections, reducing substrate size and optimizing component placement for reduced wiring lengths and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple power amplifiers are mounted on the same surface of the mounting substrate, then the substrate size can be reduced, but the wiring complexity and heat dissipation difficulty increase
Solution Approach 1:
The patent utilizes the thickness dimension of the mounting substrate by providing external connection terminals on both the first surface and the second surface. This allows power supply wiring to enter from one surface and exit from the other surface, reducing the wiring path length and complexity on the substrate surface while enabling compact arrangement of multiple power amplifiers.
2Area of stationary object
If multiple power amplifiers are mounted on the same surface, then substrate size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent provides external connection terminals on both the first surface and the second surface of the mounting substrate, enabling heat to be conducted to external heat sinks through terminals in different directions. This three-dimensional heat dissipation path reduces the thermal burden on any single surface area.
Solution Approach 2:
The patent separates the heat dissipation paths by providing independent external connection terminals for each power amplifier on different surfaces. Each power amplifier can have its own dedicated heat dissipation route to external heat sinks, preventing heat accumulation and improving overall thermal management.
3Area of stationary object
If external connection terminals are provided on both surfaces of the mounting substrate, then wiring length is reduced and substrate size can be minimized, but manufacturing complexity increases
Solution Approach 1:
The mounting substrate is designed with a standardized structure that simultaneously serves multiple functions: it provides mechanical support for power amplifiers, conducts heat to external sinks, and establishes electrical connections through terminals on both surfaces. This multi-functional design reduces the need for additional components and simplifies the overall manufacturing process.
Data Source
AI summary
A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.