Dual-Package Oscillator Thermal Isolation Design
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Solution Overview
Problem
Existing oscillators using quartz crystal resonation elements face issues with thermal influence differences between the circuit and resonation elements, leading to deteriorated temperature compensation functions, especially when used in temperature-compensated oscillators with integrated temperature sensors.
Innovation Solution
A dual-package oscillator design where the resonation and circuit elements are housed in an inner package filled with inert gas and an outer package, both airtightly sealed, with conductive joining members and bonding wires for improved thermal insulation and electrical connectivity, reducing external heat transmission and enhancing temperature stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the circuit element is housed in the outer package while the resonation element is housed in the inner package, then the structural integration is achieved, but the thermal influence from the outside greatly differs between the circuit element and the resonation element, causing deterioration of temperature compensation function
Solution Approach 1:
The patent divides the housing into two separate packages: an inner package containing the resonation element and an outer package containing the circuit element. This segmentation allows each element to be housed in its own thermal environment, enabling independent temperature management and accurate temperature compensation without thermal interference between components.
Solution Approach 2:
The patent introduces a temperature sensor as an intermediary element that detects the temperature of the resonation element and provides feedback to the circuit element. This intermediary mechanism enables the circuit element to compensate for temperature variations in the resonation element, maintaining accurate temperature compensation function despite the segmented housing structure.
2Measurement precision
If the resonation element and circuit element are placed in the same package, then the thermal coupling is improved for accurate temperature sensing, but the thermal influence from outside environment affects both elements differently, deteriorating temperature compensation accuracy
Solution Approach 1:
By segmenting the housing into inner and outer packages, the patent isolates the resonation element from external thermal influences while keeping the circuit element in the outer package. This segmentation ensures that the temperature sensor accurately measures the resonation element's temperature without being affected by external thermal variations, achieving both accurate temperature sensing and uniform thermal influence.
3Stability of the object's composition
If dual-package structure with airtight sealing is used, then thermal insulation and temperature stability are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent employs a nested doll structure where the inner package is placed inside the outer package. The inner package contains the resonation element and is airtightly sealed, while the outer package contains the circuit element and is also airtightly sealed. This nesting arrangement provides thermal insulation and temperature stability while maintaining a compact form factor, balancing the benefits of thermal isolation with the complexity of the dual-package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes the resonation characteristics, promotes thermal bonding between elements, and achieves accurate temperature compensation, resulting in a stable temperature characteristic for the oscillator.
Implementation Method 1
an inner package that houses the resonation element and the temperature sensitive element and is airtightly sealed
Implementation Method 2
a conductive first joining member that is positioned between the first base and the second base and joins the first base and the second base
Implementation Method 3
a first bonding wire for electrically connecting the first external terminal and the second internal terminal
Implementation Method 4
an oscillator using a quartz crystal resonation element
Implementation Method 5
an oscillator using a quartz crystal resonation element
Data Source
AI summary
An oscillator includes a resonation element, a temperature sensitive element, a first package that houses the resonation element and the temperature sensitive element and is airtightly sealed, and a second package that houses the first package and is airtightly sealed. The first package includes a first base having a first recessed portion that is provided on one main surface side and a first lid that is joined to the first base so as to close an opening of the first recessed portion. The second package includes a second base having a second recessed portion that is provided on one main surface side and a second lid that is joined to the second base so as to close an opening of the second recessed portion.