Dual Package Sealed Cavity for Compact Electronic Systems
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Solution Overview
Problem
Conventional surface-mount components are bulky and have complex connections due to the need for sealed enclosures, which complicates assembly and increases size.
Innovation Solution
The design involves two identical packages with protruding rims and electrical conductors that attach to each other to form a sealed cavity, with substrates supporting electronic components and conductive tracks connecting them to a printed circuit board, allowing for compact and sealed electronic systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface-mount components are enclosed in sealed enclosures, then the components are protected and sealed, but the assembly becomes bulky and connections become complicated
Solution Approach 1:
The invention divides the sealed enclosure into two separate packages, each providing partial sealing protection. The component is enclosed within one package while the other package provides additional sealing, distributing the sealing function across multiple segments rather than requiring a single large enclosure.
Solution Approach 2:
The invention implements a nested configuration where one package is positioned within or alongside another package, with the component enclosed in the inner package and the outer package providing additional sealing. This nesting approach achieves comprehensive protection while minimizing overall volume compared to conventional single-enclosure designs.
2Reliability
If conventional surface-mount components are enclosed in sealed enclosures, then the components are protected and sealed, but the connections become complicated to make
Solution Approach 1:
The connection path is segmented into distinct sections: conductors extend from the component through the first package, then through the second package, and finally to the printed circuit board. This segmentation allows each package to be optimized independently for its sealing and connection functions, simplifying the overall assembly process.
Solution Approach 2:
The invention introduces an intermediary configuration where the first package serves as a mediator between the component and the second package. The conductors pass through this intermediary structure, allowing sealed connections to be made more easily by breaking down the complex single-enclosure connection into manageable segments.
3Volume of moving object
If two identical packages are attached by their rims to define a sealed cavity, then the assembly becomes compact, but the manufacturing precision requirements increase
Solution Approach 1:
While the packages are identical in overall form, the invention introduces asymmetric features at the rim attachment interface, such as protrusions and recesses, that guide precise alignment. This allows the symmetric packages to be joined with high precision through localized asymmetric features that are easier to manufacture and align.
Solution Approach 2:
The rim attachment structure is designed to self-align during assembly, where the protruding rim of one package naturally fits into the recess of the other package. This self-aligning mechanism reduces the need for high-precision external alignment tools and processes, making the compact configuration manufacturable with standard precision.
Data Source
AI summary
An electronic system including at least one component, two identical packages including a bottom from which a peripheral rim protrudes defining a recess, and electrical conductors passing through each package, the packages being attached to one another by the rim thereof so as to define a sealed cavity therebetween. An electronic device including two systems of this type superimposed on one another.