Dual-Path Sulfuric Acid Delivery for Stable Substrate Cleaning

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Solution Overview

Problem

The rapid temperature changes and high temperatures of sulfuric acid-hydrogen peroxide mixtures used in substrate processing can cause damage to substrates, such as peeling of patterns, and adjusting the mixing ratio of sulfuric acid and hydrogen peroxide is time-consuming.

Innovation Solution

A substrate processing apparatus with separate paths for sulfuric acid, one heated and one unheated, allows controlled mixing and ejection of sulfuric acid and hydrogen peroxide solutions onto the substrate to maintain stable temperatures, preventing violent reactions and substrate damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sulfuric acid and hydrogen peroxide solution are mixed at high temperature to process the substrate, then the processing effectiveness is improved, but the substrate temperature changes rapidly causing damage such as pattern peeling

Engineering Contradiction:
Improveprocessing effectivenessVSAvoidsubstrate damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The sulfuric acid supply path is divided into two separate paths: a first path with a heater for heating sulfuric acid, and a second path without heating. This segmentation allows selective mixing of heated or unheated sulfuric acid with hydrogen peroxide solution to control reaction temperature and prevent substrate damage

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The temperature of sulfuric acid is changed as a controllable parameter. By adjusting whether to heat the sulfuric acid in the first path before mixing with hydrogen peroxide solution, the reaction temperature can be controlled to achieve effective processing while preventing excessive temperature rise that causes substrate damage

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If the mixing ratio of sulfuric acid and hydrogen peroxide solution is adjusted to prevent substrate damage, then the substrate temperature stability is improved, but the adjustment process takes time

Engineering Contradiction:
Improvesubstrate temperature stabilityVSAvoidadjustment time
Core Design Contradiction:
Stability of the object's compositionVSLoss of time

Solution Approach 1:

Instead of adjusting the mixing ratio of sulfuric acid and hydrogen peroxide solution, the invention changes the temperature parameter of sulfuric acid by selecting different paths (heated or unheated). This parameter change achieves substrate temperature stability without requiring time-consuming mixing ratio adjustments

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The supply path is segmented into heated and unheated routes, allowing rapid switching between different temperature conditions. This eliminates the need for gradual mixing ratio adjustments and reduces the time required to achieve stable substrate temperature

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively stabilizes substrate temperatures during processing, reducing the risk of damage and eliminating the need for time-consuming mixing ratio adjustments.

Implementation Method 1

a first heater that heats a heating region of the first path

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

when sulfuric acid and a hydrogen peroxide solution are mixed, the sulfuric acid and the hydrogen peroxide solution react, and the temperature of the sulfuric acid-hydrogen peroxide mixture becomes high

Methodology Applied
Scientific EffectExothermic reaction: Exothermic Reaction

Data Source

PatentUS12532690B2Substrate processing apparatus and substrate processing method
Publication Date: 2026.01.20 SCREEN HOLDINGS CO LTD
  • US12532690B2 patent drawing
  • US12532690B2 patent drawing
  • US12532690B2 patent drawing

AI summary

A substrate processing apparatus includes a first tank, a path including a first path, a first heater, a hydrogen peroxide supply path, and a controller. The first path allows sulfuric acid to be supplied therethrough from the first tank to a nozzle. The first heater heats a heating region of the first path. The controller controls ejecting sulfuric acid heated by the first heater and a hydrogen peroxide solution from the nozzle onto a substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed, and then ejecting sulfuric acid having a temperature lower than a temperature of the sulfuric acid heated by the first heater and the hydrogen peroxide solution from the nozzle onto the substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed.