Dual-Path Liquid Supply for Dummy Dispense Flow Control
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Solution Overview
Problem
In substrate processing apparatuses, the high flow rate of liquid ejected during dummy dispense can cause clogging of filters and ventilation mechanism malfunctions, and there is a need to conserve liquid usage by minimizing the amount ejected during this process.
Innovation Solution
A substrate processing apparatus with a liquid supplier system that includes a dual pipe configuration with adjustable flow rates, utilizing a first pipe and a second pipe with a fluid resistance element to set a higher pressure loss, allowing for adjustable flow rates and minimizing liquid usage during dummy dispense.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high flow rate liquid is ejected from the nozzle during dummy dispense, then the liquid effectively replaces old liquid in the pipe, but the liquid causes filter clogging and ventilation mechanism malfunction
Solution Approach 1:
The system dynamically switches between two pipe configurations based on operational mode. During dummy dispense, the second pipe with fluid resistance element is activated to limit flow rate. During actual substrate processing, the first pipe provides high flow rate. This dynamic adaptation resolves the contradiction between needing high flow for liquid replacement and low flow for preventing filter clogging.
Solution Approach 2:
The system changes the flow rate parameter by selecting different pipe paths. The second pipe includes a fluid resistance element that reduces the liquid flow rate to a safe level during dummy dispense, preventing filter clogging. The first pipe allows high flow rate during actual processing. This parameter change based on operational context resolves the technical contradiction.
2Quantity of substance
If high flow rate liquid is ejected during dummy dispense, then liquid replacement is effective, but liquid usage is excessive
Solution Approach 1:
The system changes the flow rate parameter based on operational mode. During dummy dispense, the second pipe with fluid resistance element limits the flow rate to minimize liquid consumption while still achieving adequate liquid replacement. During actual substrate processing, the first pipe enables high flow rate for effective liquid supply. This parameter adaptation resolves the contradiction between effective liquid replacement and liquid conservation.
3Loss of substance
If the nozzle is equipped with flow rate control, then liquid usage is minimized and filter clogging is prevented, but the device complexity increases
Solution Approach 1:
The liquid supply system is segmented into two separate pipe paths: the first pipe for high flow rate substrate processing and the second pipe with fluid resistance element for low flow rate dummy dispense. This segmentation allows flow rate control without adding complex control mechanisms to the nozzle itself, resolving the contradiction between liquid conservation and device simplicity.
Solution Approach 2:
The fluid resistance element in the second pipe acts as an intermediary that passively limits the flow rate during dummy dispense. Instead of using an active control mechanism at the nozzle, the system uses this intermediate component to automatically restrict flow, simplifying the overall device structure while achieving flow rate control and liquid conservation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively adjusts the flow rate of the liquid ejected from the nozzle, preventing filter clogging and ensuring proper ventilation while conserving liquid, thus maintaining apparatus functionality and efficiency.
Implementation Method 1
a fluid resistance element (246) attached to the second pipe (224) and configured to set a pressure loss of the liquid flowing through the second pipe (224) to be larger than a pressure loss of the liquid flowing through the first pipe (222)
Data Source
AI summary
The present disclosure provides a substrate processing apparatus capable of adjusting a flow rate of a liquid to be ejected from a nozzle. The substrate processing apparatus according to the present disclosure is a substrate processing apparatus including a nozzle configured to supply a liquid to a substrate, and a liquid supplier configured to supply the liquid to the nozzle, in which the liquid supplier includes a supply pipe which is configured to cause a liquid supply source and the nozzle to be in fluid communication and which has a first pipe constituting a first flow channel from a splitting point to a joining point located downstream of the splitting point and a second pipe constituting a second flow channel from the splitting point to the joining point, a first valve attached to the first pipe, a second valve attached to the second pipe, and a fluid resistance element attached to the second pipe and configured to set a pressure loss of the liquid flowing through the second pipe to be larger than a pressure loss of the liquid flowing through the first pipe.