Dual-Path Heat Sink Layout for Induction Range Electronics Cooling

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Solution Overview

Problem

Induction heating electric ranges face inefficiencies in cooling electronic elements due to indirect cooling methods, leading to operational errors and potential damage from increased temperatures.

Innovation Solution

A heat sink with a cuboid trapezoidal shape and air flow paths is integrated into the electric range, featuring heat dissipation fins and an air guide to enhance cooling efficiency by increasing contact surface area and directing airflow effectively, while the air blowing fan supplies air to the heat sink and electronic elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If indirect cooling method is used where air flows through heat sink first then to electronic elements, then heat sink can be cooled effectively, but cooling efficiency of electronic elements is reduced

Engineering Contradiction:
Improveheat sink temperatureVSAvoidcooling efficiency of electronic elements
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The cooling system is segmented into two distinct cooling channels: a first cooling channel that directs air flow directly to electronic elements, and a second cooling channel that directs air flow to the heat sink. This segmentation allows each component to receive dedicated cooling airflow, resolving the contradiction by enabling both the heat sink and electronic elements to be cooled effectively simultaneously rather than using a single indirect path.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If heat sink is designed with basic shape and spacing, then manufacturing is simple, but contact surface area with air is insufficient reducing cooling efficiency

Engineering Contradiction:
Improveheat sink manufacturing simplicityVSAvoidcooling efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The heat sink transitions from a basic two-dimensional flat structure to a three-dimensional structure with protruding fins that extend vertically. This dimensional change significantly increases the contact surface area between the heat sink and cooling air, enhancing heat dissipation efficiency while maintaining manufacturing feasibility through standard fin fabrication processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves cooling efficiency, reduces temperature differences across the heat sink, and prevents operational errors by ensuring effective cooling of electronic elements, thereby extending the lifespan and reliability of the electric range.

Implementation Method 1

a heat sink which is mounted on the circuit board... the heat sink... connects to any one of the electronic circuit boards

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a fan unit... supplying air to the heat sink... a temperature of the heat sink unit is reduced by the air

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a fan unit... supplying air to the heat sink... Most of the air output from the fan unit flows into the heat sink unit

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 4

a heat sink with a cuboid trapezoidal shape and air flow paths is integrated into the electric range, featuring heat dissipation fins

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20220386447A1Home appliance and heat sink installed therein
Publication Date: 2022.12.01 LG ELECTRONICS INC
  • US20220386447A1 patent drawing
  • US20220386447A1 patent drawing
  • US20220386447A1 patent drawing

AI summary

A home appliance is provided that may include a first air flow path included in a heat sink, and a second air flow path defined at a lower side of the heat sink, such that air flows to inside and outside of the heat sink efficiently. A plurality of heat dissipation fins may protrude downward from a wall of the second air flow path, increasing a contact surface between the heat sink and air. A projection may be formed on at least one of the walls of the first air flow path, the walls of the second air flow path, an outer surface of the plurality of heat dissipation fins, or an upper surface of the heat sink.