Dual-Path PCB Interconnect Layout Without High-Speed Signal Stubs
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Solution Overview
Problem
Designing printed circuit boards (PCBs) that can route high-speed signals to multiple destinations without compromising signal integrity is challenging, as existing methods often introduce stubs that degrade signal quality and increase board footprint, especially for high-speed interfaces like PCIe busses.
Innovation Solution
A dual-path high-speed interconnect on the PCB is achieved by modifying the cable connector footprint to integrate solder pads for zero-ohm resistors, allowing signals to be routed to either a cable connector or an embedded device without adding stubs, through a pair of resistor-solder pads and a connector-solder pad with a gap, enabling selection via bill of materials (BOM) options.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a high-speed signal trace is routed to multiple destinations using traditional methods, then routing flexibility is improved, but signal integrity deteriorates due to stub formation
Solution Approach 1:
The signal path is segmented into multiple independent traces (first signal trace and second signal trace) that diverge from a common origin. Each trace provides a dedicated path to different destinations (cable connector or embedded device), eliminating the need for signal branching and preventing stub formation while maintaining routing flexibility.
2Adaptability or versatility
If traditional routing methods are used to connect to multiple destinations, then routing options increase, but board footprint increases
Solution Approach 1:
Multiple routing options are merged into a single compact footprint structure. The first and second signal traces share a common origin region and are routed in close proximity, allowing the PCB to support multiple destinations without requiring separate, dispersed routing paths that would increase board footprint.
3Ease of manufacture
If traditional connector footprints are used, then manufacturing simplicity is maintained, but dual-path routing without stubs cannot be achieved
Solution Approach 1:
The connector footprint is locally modified to incorporate both a first solder pad region and a second solder pad region with specific geometric characteristics. These localized modifications enable dual-path routing capability while maintaining the overall simplicity of the connector footprint design and manufacturing process.
Data Source
AI summary
A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.