Dual-Path Temperature Sensor Assembly for Consistent Vessel-Wall Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing non-intrusive process temperature measurement assemblies face challenges in reproducible manufacturing and mounting, leading to inconsistent thermal coupling and reduced accuracy due to varying thermal resistances and interactions with the ambient environment.
Innovation Solution
A temperature sensor assembly with a first and second single-branched thermal conduction path, where the temperature measurement sensor has a stronger thermal coupling to the vessel wall than the reference sensor, and both paths are insulated to reduce thermal coupling between them, using materials like mineral-insulated cabling and low thermal conductivity materials to maintain defined thermal resistances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If non-intrusive temperature measurement is used to avoid penetrating vessel walls, then safety and ease of operation are improved, but measurement precision deteriorates due to thermal resistance and ambient interference
Solution Approach 1:
The measurement system is segmented into two independent thermal paths: one for the measurement sensor with strong thermal coupling to the vessel wall, and another for the reference sensor with weaker thermal coupling. This segmentation allows each sensor to have optimized thermal characteristics, improving overall measurement precision while maintaining non-intrusive operation.
Solution Approach 2:
A reference temperature sensor is introduced as an intermediary element that measures the ambient temperature affecting the measurement path. This reference sensor acts as a mediator to detect and compensate for thermal interference from the environment, thereby improving measurement precision without compromising the non-intrusive nature of the system.
2Measurement precision
If thermal coupling between sensor and vessel wall is strengthened to improve measurement precision, then measurement precision is improved, but reliability deteriorates due to manufacturing and mounting variability
Solution Approach 1:
By dividing the thermal coupling into two distinct paths with different coupling strengths, the system achieves measurement precision through the strongly coupled path while the reference path provides a stable baseline. This segmentation reduces the impact of manufacturing and mounting variability on overall system reliability.
Solution Approach 2:
The reference temperature sensor provides feedback about the thermal conditions affecting the measurement path. This feedback mechanism allows for compensation of thermal drift and variability, improving reliability by correcting for manufacturing and mounting differences in the thermal coupling.
3Measurement precision
If insulation is added to shield probe tip from ambient conditions to improve measurement precision, then measurement precision is improved, but device complexity increases
Solution Approach 1:
Instead of adding complex insulation structures, a reference temperature sensor is used as an intermediary to detect ambient thermal effects. This approach improves measurement precision through software-based compensation rather than physical insulation, avoiding increased device complexity.
Solution Approach 2:
The patent replaces mechanical insulation solutions with a thermal compensation method using a reference sensor and calculation algorithms. This substitution eliminates the need for complex insulating structures while achieving the same goal of shielding against ambient thermal interference.
4Reliability
If tolerances are reduced or durability increased to improve reliability, then reliability is improved, but manufacturing cost and effort increase
Solution Approach 1:
The system segments the thermal measurement into two independent paths, allowing each to have relaxed tolerance requirements. The differential measurement approach means that absolute precision of individual components is less critical, simplifying manufacturing while maintaining overall reliability.
Solution Approach 2:
The reference sensor provides continuous feedback that compensates for variations in thermal coupling characteristics. This feedback mechanism allows the system to maintain high reliability even with wider manufacturing tolerances, reducing the need for precision manufacturing and assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures accurate, reliable, and fast-responsive surface temperature measurements by minimizing thermal interference, enhancing the reproducibility and durability of the measurement process.
Implementation Method 1
the first single-branched thermal conduction path and/or the second single-branched thermal conduction path are insulated by a low thermal conducting material to reduce a thermal coupling between the first single-branched thermal conduction path and the second single-branched thermal conduction path
Implementation Method 2
a first single-branched thermal conduction path, between the surface of the vessel wall and an environment of the temperature sensor assembly, with a temperature measurement sensor, configured to be thermally coupled to a first site of the surface of the vessel wall
Implementation Method 3
a second single-branched thermal conduction path, between a second site of the surface of the vessel wall and an environment of the temperature sensor assembly, comprising a reference temperature sensor, configured to be thermally coupled to the surface of the vessel wall
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A temperature sensor assembly configured to be coupled thermally to a vessel wall for determining a temperature of a surface of the vessel wall is provided, the assembly includes: a first single-branched thermal conduction path, between the surface of the vessel wall and an environment of the temperature sensor assembly, comprising a temperature measurement sensor, configured to be thermally coupled to a first site of the surface of the vessel wall resulting in a first thermal resistance; and a second single-branched thermal conduction path, between a second site of the surface of the vessel wall and an environment of the temperature sensor assembly, comprising a reference temperature sensor, configured to be thermally coupled to the surface of the vessel wall resulting in a second thermal resistance.