Dual-Patterned Sputter Traps for Particle Redeposition Control
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Solution Overview
Problem
Sputtering chamber components face issues with particle generation and redeposition, leading to contamination and device failure due to the buildup of sputtered material on surfaces within the chamber, which can cause shorts, plasma arcing, and interruptions in the deposition process.
Innovation Solution
A particle trap with a dual patterned surface, featuring a combination of indentations and ridges formed into the surface of sputtering chamber components, such as coils and targets, to capture and trap redeposited particles, thereby preventing contamination and improving the surface area for adhesion, without requiring additional texturing methods like grit blasting or wire brushing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a smooth surface is used in the sputtering chamber, then the deposition process is simple and easy to manufacture, but particles are generated and redeposited causing contamination and device failure
Solution Approach 1:
The patent applies a porous anodized oxide layer on the sputtering chamber surface. This porous structure provides numerous nucleation sites that trap sputtered particles, preventing their redeposition on substrates. The porous layer is formed through electrochemical anodization, creating a controlled pore structure that effectively captures particles while maintaining manufacturing feasibility through a standardized electrochemical process.
Solution Approach 2:
The patent changes the surface parameters by creating an anodized oxide layer with specific pore dimensions and surface roughness. This parameter change transforms the smooth surface into a textured surface with controlled porosity, enabling effective particle trapping. The anodization process allows precise control over pore size, depth, and distribution, optimizing particle capture while maintaining ease of manufacture through electrochemical processing.
2Reliability
If grit blasting or wire brushing is used to texture the surface, then particle trapping is improved, but additional texturing methods increase manufacturing complexity and cost
Solution Approach 1:
The patent replaces mechanical texturing methods (grit blasting, wire brushing) with an electrochemical anodization process. This substitution eliminates the need for complex mechanical equipment and manual operations, reducing manufacturing complexity. The electrochemical process automatically creates the desired surface texture through controlled oxidation, providing consistent results without the variability and complexity associated with mechanical texturing methods.
Solution Approach 2:
The patent achieves particle trapping functionality by changing the chemical and physical parameters of the surface through anodization. Instead of mechanically altering the surface, the process uses electrochemical reactions to form an oxide layer with specific porosity and roughness parameters. This parameter change approach simplifies manufacturing by using a single electrochemical step rather than multiple mechanical processing steps.
3Productivity
If the sputtering chamber surfaces are left untextured, then manufacturing is simpler and faster, but particle buildup occurs causing plasma arcing and deposition interruptions
Solution Approach 1:
The patent applies a preliminary anodization treatment to the sputtering chamber surfaces before deposition begins. This preliminary action creates a porous oxide layer that proactively traps particles during subsequent deposition processes, preventing particle buildup that would otherwise cause plasma arcing and interruptions. The anodized surface is prepared in advance, ensuring continuous productive operation without the need for frequent chamber maintenance or interruptions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual patterned surface effectively captures redeposited particles, reducing contamination and surface tension, thereby enhancing the reliability and longevity of sputtering chamber components by preventing particle buildup and maintaining a stable deposition process.
Implementation Method 1
A particle trap with a dual patterned surface, featuring a combination of indentations and ridges formed into the surface of sputtering chamber components, such as coils and targets, to capture and trap redeposited particles
Implementation Method 2
Sputtering includes forming a target of a material which is to be deposited, and providing the target as a negatively charged cathode proximate to a strong electric field. The electric field is used to ionize a low pressure inert gas and form plasma. Positively charged ions in the plasma are accelerated by the electric field toward the negatively charged sputtering target. The ions impact the sputtering target, and thereby eject target material.
Data Source
AI summary
A method of forming a particle trap on a sputtering chamber component comprises forming a first pattern on at least a portion of a surface of the sputtering chamber component to form a first patterned top surface, and forming a second pattern on at least a portion of the first patterned top surface.