Dual-PCB Heat Sink Assembly With Conductive Frame Cooling
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Solution Overview
Problem
Conventional electronic assemblies with dual circuit board configurations require complex and costly heat sinks for each board, leading to increased manufacturing costs without effective cooling.
Innovation Solution
An electronic assembly design featuring a single heat sink with a thermally conductive frame that transfers heat between two circuit boards and allows airflow through dissipation channels, eliminating the need for multiple complex heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If each circuit board assembly is cooled by an exclusive heat sink, then the cooling effectiveness is improved, but the manufacturing cost significantly increases
Solution Approach 1:
The patent combines two separate heat sink structures into a single integrated heat sink that serves both circuit board assemblies. The heat sink includes a base with first and second heat dissipation surfaces, where the first heat dissipation surface is coupled to the first circuit board assembly and the second heat dissipation surface is coupled to the second circuit board assembly, eliminating the need for two separate heat sinks and their corresponding molds.
Solution Approach 2:
The single heat sink performs multiple cooling functions simultaneously. It provides thermal management for both the first circuit board assembly (via the first heat dissipation surface) and the second circuit board assembly (via the second heat dissipation surface), making one component serve universal cooling purposes for multiple heat-generating components.
2Ease of manufacture
If a single heat sink is used for both circuit board assemblies, then the manufacturing cost is reduced, but the cooling effectiveness may be compromised
Solution Approach 1:
The heat sink is segmented into distinct functional zones with separate heat dissipation surfaces. The first heat dissipation surface is specifically configured and coupled to the first circuit board assembly, while the second heat dissipation surface is configured and coupled to the second circuit board assembly, allowing each surface to independently and effectively cool its respective circuit board without thermal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools both circuit boards without significantly increasing manufacturing costs by using a single heat sink and thermally conductive frame, enhancing heat dissipation efficiency.
Implementation Method 1
two opposite sides of the thermally conductive frame are thermally coupled to the base and the first heat source, respectively
Implementation Method 2
The plurality of heat dissipation fins protrude from a side of the base. The base is thermally coupled to the second heat source.
Implementation Method 3
the thermally conductive frame forms at least one heat dissipation channel... allows the cold air to flow through the heat dissipation channel
Data Source
AI summary
An electronic assembly including a first circuit board assembly, a second circuit board assembly, a heat sink and a thermally conductive frame. The first circuit board assembly includes a first circuit board and a first heat source. The second circuit board assembly includes a second circuit board and a second heat source. The heat sink is located between the first circuit board and the second circuit board and includes a base and a plurality of heat dissipation fins. The plurality of heat dissipation fins protrude from a side of the base. The base is thermally coupled to the second heat source. The thermally conductive frame protrudes from the side of the base. Two opposite sides of the thermally conductive frame are thermally coupled to the base and the first heat source, respectively, and the thermally conductive frame forms at least one heat dissipation channel.