Dual-PCB Package Layout for Compact Sensor Interconnection
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Solution Overview
Problem
Existing electronic devices, including time-of-flight sensors, face challenges in packaging and interconnecting electronic elements, leading to bulkiness and inefficiencies.
Innovation Solution
The proposed solution involves a device comprising first and second printed circuit boards, walls coupling these boards, electric conductors in the walls for interconnection, an integrated circuit chip, and surface-mounted components, which together form a compact and efficient package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple electronic components are assembled in a package and interconnected, then electrical connections can be established, but the device becomes bulky and complex
Solution Approach 1:
The patent merges multiple separate components (integrated circuit chip, surface-mounted components, optical elements) into a single integrated device structure where all elements are mounted on printed circuit boards within a unified package, eliminating the need for separate packages and interconnections between multiple devices
Solution Approach 2:
The printed circuit boards serve multiple functions simultaneously: they provide mechanical support for mounting components, provide electrical interconnections through conductive tracks and vias, provide structural framework for the package, and enable both optical and electrical signal transmission pathways
2Reliability
If multiple electronic components are assembled in a package, then electrical connections can be established, but the device size increases
Solution Approach 1:
The patent utilizes three-dimensional space efficiently by arranging components on different layers (first and second printed circuit boards at different heights) and using vertical vias to connect between layers, transforming a two-dimensional layout problem into a three-dimensional solution that reduces the horizontal footprint
3Adaptability or versatility
If optical elements are included in the device, then optical functions can be performed, but the device becomes bulkier
Solution Approach 1:
The patent combines optical elements (such as lenses, windows, or optical filters) with the electronic components on the same printed circuit board structure, integrating optical pathways through the package without requiring separate optical housings or additional space
Data Source
AI summary
A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.