Dual Phase Change Materials for Semiconductor Thermal Management
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Solution Overview
Problem
Existing cooling systems for electronic device assemblies are often cost-prohibitive and oversized due to the need to accommodate both transient and steady-state heat loads, particularly in semiconductor devices that experience high peak heat flux during transient operations.
Innovation Solution
The use of dual phase change materials, where a first phase change material absorbs heat during normal operations and a second phase change material stores energy during transient spikes, allowing for efficient cooling of semiconductor devices across both heat flux states without overdesigning the cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cooling system is designed to meet the transient load requirement, then the semiconductor device can handle high peak heat flux, but the system becomes cost-prohibitive, oversized, and heavy
Solution Approach 1:
The cooling system is segmented into two distinct functional components: a first phase change material that changes phase at a first temperature to handle transient heat loads, and a second phase change material that changes phase at a second temperature to handle steady-state heat loads. This segmentation allows each material to be optimized for its specific thermal regime, preventing the need for an oversized single-system design that would accommodate peak transient conditions.
Solution Approach 2:
The system utilizes parameter changes by employing phase change materials with different phase change temperatures. The first phase change material has a lower phase change temperature optimized for transient conditions, while the second phase change material has a higher phase change temperature optimized for steady-state conditions. This parameter differentiation enables the cooling system to match thermal response characteristics to specific operational requirements, reducing overall system mass.
2Productivity
If the cooling system is designed to meet the transient load requirement, then the semiconductor device can handle high peak heat flux, but the system becomes cost-prohibitive and oversized
Solution Approach 1:
The cooling system is divided into two functional segments: a first phase change material for transient heat load management and a second phase change material for steady-state heat load management. Each segment is independently optimized for its specific thermal regime, allowing the system to handle transient peaks efficiently without requiring the entire system to be oversized for maximum transient capacity.
Solution Approach 2:
The system employs parameter changes through phase change materials with distinct phase change temperatures. The first material changes phase at a lower temperature during transient events, while the second material changes phase at a higher temperature during steady-state operation. This parameter-based differentiation simplifies the design by eliminating the need for complex control mechanisms to manage a single oversized system.
3Adaptability or versatility
If a single phase change material is used, then the system structure is simpler, but it cannot efficiently manage both transient and steady-state heat loads
Solution Approach 1:
The cooling system is segmented into two functional components with distinct phase change temperatures: a first phase change material optimized for transient heat loads and a second phase change material optimized for steady-state heat loads. This segmentation enables the system to adapt to different thermal conditions without requiring complex control mechanisms, as each material automatically activates based on temperature conditions.
Solution Approach 2:
The dual phase change material system provides multi-functionality by simultaneously addressing both transient and steady-state heat load management. The first phase change material handles transient peaks while the second handles steady-state conditions, creating a universal cooling solution that adapts to varying operational requirements without requiring separate cooling systems for different modes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages both transient and steady-state heat loads, reducing the overall cost and weight of the cooling system while maintaining constant semiconductor device temperatures, by utilizing a first phase change material for active cooling and a second phase change material for energy storage during transient operations.
Implementation Method 1
The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
Implementation Method 2
The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state
Implementation Method 3
Cooling fluid may be used in heat transfer devices to receive heat generated by the heat generating device by convective thermal transfer
Implementation Method 4
Other heat transfer devices may remove thermal energy by two-phase heat transfer, wherein coolant fluid is converted from a liquid phase to a gas phase at the location of thermal flux.
Data Source
AI summary
Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.