Dual-Phase Heat Dissipation System for Thin Electronic Devices
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Solution Overview
Problem
Existing thermal management systems in electronic devices face challenges in efficiently dissipating heat without increasing device thickness or generating noise, particularly in thin form-factor devices with high thermal loads, as conventional vapor chambers and heat pipes are limited by capillary action and require larger pumps or fans, leading to space constraints and acoustic noise.
Innovation Solution
The implementation of a heat dissipation system with a vapor chamber and a micro-pump that dynamically adjusts fluid flow rate and volume using a reservoir external to the chamber, enhancing capillary action and allowing for thinner, quieter operation by increasing thermal load capacity without increasing device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vapor chambers and heat pipes are used for heat dissipation, then heat transfer capability is improved, but device thickness increases and acoustic noise is generated due to required pumps and fans
Solution Approach 1:
The patent utilizes phase transitions of the heat transfer fluid between liquid and vapor states within the vapor chamber to achieve high heat transfer capability. The fluid evaporates at the heating surface, absorbs latent heat, condenses in the cooling channels, and returns to the evaporator through capillary wicking, creating a continuous heat transfer cycle without requiring external pumps or fans, thereby maintaining thin device profile while achieving effective heat dissipation
Solution Approach 2:
The vapor chamber design employs capillary wicking structures that automatically return condensed liquid to the evaporator region without external pumping. The system is self-regulating, where the phase change process itself drives the heat transfer cycle, eliminating the need for acoustic noise-generating fans or pumps while maintaining effective heat dissipation
2Reliability
If larger pumps or fans are used to enhance fluid flow in heat dissipation systems, then thermal load capacity is improved, but acoustic noise increases
Solution Approach 1:
The system uses capillary wicking structures that automatically return condensed liquid to the evaporator region without external pumping. The phase change process itself drives the heat transfer cycle, eliminating the need for acoustic noise-generating fans or pumps while maintaining effective heat dissipation
Solution Approach 2:
The patent utilizes phase transitions of the heat transfer fluid between liquid and vapor states within the vapor chamber to achieve high heat transfer capability. The fluid evaporates at the heating surface, absorbs latent heat, condenses in the cooling channels, and returns to the evaporator through capillary wicking, creating a continuous heat transfer cycle without requiring external pumps or fans
3Length of stationary object
If device thickness is reduced for thin form-factor design, then device portability is improved, but heat dissipation capability deteriorates due to space constraints
Solution Approach 1:
The patent utilizes phase transitions of the heat transfer fluid between liquid and vapor states within the vapor chamber to achieve high heat transfer capability. The fluid evaporates at the heating surface, absorbs latent heat, condenses in the cooling channels, and returns to the evaporator through capillary wicking, creating a continuous heat transfer cycle without requiring external pumps or fans, thereby maintaining thin device profile while achieving effective heat dissipation
Solution Approach 2:
The invention employs a two-phase heat transfer system utilizing vapor and liquid phases of a working fluid. The vapor chamber contains the heat transfer fluid that undergoes phase changes, with vapor rising to cooling channels and liquid returning through capillary wicking, enabling efficient heat dissipation in a compact, thin form factor without requiring complex hydraulic pumping systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat in thinner electronic devices with lower operating temperatures and reduced noise, maintaining efficient performance by dynamically adjusting fluid flow based on workload demands.
Implementation Method 1
a phase change material in communication with the second surface of the heat spreader. The phase change material absorbs heat from the second surface
Implementation Method 2
a vapor chamber in communication with the processor. The vapor chamber absorbs heat from the processor
Implementation Method 3
enhancing capillary action and allowing for thinner, quieter operation by increasing thermal load capacity
Data Source
AI summary
Heat dissipation systems, apparatus, articles of manufacture, and methods are disclosed. An example computing device includes a display, a keyboard, processor circuitry, and a dual-phase heat dissipation system. The dual-phase dissipation system includes a housing defining a chamber, a fluid inlet, and a fluid outlet. The chamber receives a working fluid via the fluid inlet. A pump fluidly couples to the fluid inlet and the fluid outlet of the housing. The pump is to receive the working fluid via the fluid outlet of the housing and increase at least one of a flow rate or volume of the working fluid at the fluid inlet.