Dual-Pipe Heat Pipe Capillary Structure for High Heat Flux
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Solution Overview
Problem
Conventional heat pipes struggle to meet the increasing demands of high heat and high heat flux in electronic products due to limitations in heat transfer capability and complexity in structure design, which affects manufacturing efficiency and cost.
Innovation Solution
A heat pipe design comprising a first pipe with an evaporator, condenser, and heat insulator, along with a second pipe containing a capillary structure that extends outside to form a second capillary structure, enhancing vapor flow directionality and liquid-vapor circulation efficiency, while maintaining a simple structure for cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat pipe structure is used, then manufacturing is simple, but heat transfer capability is insufficient for high heat flux applications
Solution Approach 1:
The heat pipe is divided into two concentric pipes: an inner pipe containing a first capillary structure and an outer pipe containing a second capillary structure. This segmentation allows each pipe to handle different portions of the heat flux, with the inner pipe handling central heat flow and the outer pipe handling peripheral heat flow, thereby enhancing overall heat transfer capability while maintaining manufacturability through modular assembly
Solution Approach 2:
The inner pipe is nested within the outer pipe, creating a compact dual-capillary-structure configuration. The first capillary structure in the inner pipe and the second capillary structure in the outer pipe work simultaneously to transport working fluid, effectively increasing the heat transfer surface area and heat flux handling capacity without significantly increasing the overall footprint or manufacturing complexity
2Reliability
If multiple capillary structures are used to enhance capillarity, then heat transfer performance improves, but structure becomes too complicated
Solution Approach 1:
The capillary structures are segmented into two independent systems: the first capillary structure within the inner pipe and the second capillary structure within the outer pipe. Each capillary structure can be independently designed and manufactured with optimal pore sizes and distributions for their respective locations, then assembled together to form the complete heat pipe, balancing performance enhancement with manufacturing simplicity
Solution Approach 2:
The nested dual-pipe configuration allows both capillary structures to coexist in a compact arrangement. The inner pipe with its capillary structure is positioned centrally within the outer pipe containing the second capillary structure, creating an integrated yet simple-to-manufacture assembly that achieves enhanced heat transfer without excessive structural complexity
3Device complexity
If vapor and working fluid flow in opposite directions without insulation, then structure is simple, but vapor resistance reduces circulation efficiency
Solution Approach 1:
The vapor flow path and liquid return path are segmented into separate concentric zones: vapor flows through the central region of the evaporator while the working fluid returns through the annular region between the inner and outer pipes. This spatial segmentation reduces vapor resistance to liquid flow and improves circulation efficiency while maintaining a relatively simple sealed pipe structure
Solution Approach 2:
The nested pipe configuration naturally creates separate flow channels: the inner pipe region for vapor movement and the annular region for liquid return. This nested arrangement provides passive flow separation without requiring additional insulation barriers or complex internal structures, thereby improving circulation efficiency while preserving structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances heat transfer capability, reduces manufacturing complexity and costs, and improves the heat pipe's ability to handle high heat and high heat flux, making it suitable for electronic applications.
Implementation Method 1
Lastly is driven by the capillarity to go back to the evaporator through the capillary structure
Implementation Method 2
The generated vapor is driven by the vapor pressure difference to flow to the condenser of the heat pipe
Implementation Method 3
The first pipe includes an evaporator, a heat insulator and a condenser which communicate with each other
Data Source
AI summary
A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.