Dual-Plate Stage Temperature Control for Substrate Warpage
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Solution Overview
Problem
Substrate warpage and stage deformation due to thermal stress in substrate processing are challenging to control effectively in existing technologies, leading to inefficiencies in substrate processing and etching characteristics.
Innovation Solution
A substrate processing apparatus with a stage featuring a first and second plate, each with independent temperature adjustment mechanisms, and a fastening mechanism to control thermal stress and deformation, allowing precise temperature control to manage substrate placement surface shape and improve adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single temperature control mechanism is used for the stage, then the device complexity is reduced, but the manufacturing precision deteriorates due to inability to independently control temperature distribution
Solution Approach 1:
The stage is divided into multiple temperature control zones with independent mechanisms. The stage includes a first plate with a first temperature adjustment mechanism and a second plate with a second temperature adjustment mechanism, allowing independent temperature control of different regions to precisely manage substrate placement surface shape.
Solution Approach 2:
Different regions of the stage are given different temperature control capabilities. The first plate and second plate can be controlled to different temperatures independently, enabling local temperature optimization for specific processing requirements while maintaining overall system functionality.
2Manufacturing precision
If independent temperature control mechanisms are provided for each plate, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The temperature control system is segmented into independent first and second temperature adjustment mechanisms corresponding to the first and second plates. This segmentation allows each mechanism to be optimized for its specific plate while maintaining overall coordination through the fastening member that couples the plates together.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise control of substrate deformation, enhancing etching characteristics by reducing in-plane temperature distribution and improving the adhesion between the substrate and the electrostatic chuck, thus addressing the challenges of substrate warpage and stage deformation.
Implementation Method 1
a first temperature adjustment mechanism configured to control a temperature of the first plate
Implementation Method 2
a second temperature adjustment mechanism configured to control a temperature of the second plate
Data Source
AI summary
A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.