Dual Heat Dissipation Plate Package for Uniform Thermal Conduction

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Solution Overview

Problem

Existing semiconductor packages face challenges in efficiently and uniformly dissipating heat generated by components like voltage regulator modules (VRMs) and semiconductor dies, leading to non-uniform thermal conduction and potential deformation issues.

Innovation Solution

A semiconductor package design featuring dual heat dissipation plates with lug bosses and through holes, combined with fix screws and nuts, ensures uniform attachment and thermal conduction by compensating for production tolerances and height variations through adjustable torque and stroke mechanisms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat generating components are attached to heat dissipation plates, then heat dissipation function is improved, but non-uniform thermal conduction and deformation issues occur due to production tolerances and height variations

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal conduction uniformity

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent employs adjustable torque and stroke mechanisms in the attachment system that allow dynamic compensation for height variations and production tolerances. The fix screws with adjustable stroke enable the heat generating components to be pressed uniformly against the thermal interface materials despite variations in component heights, thereby achieving uniform thermal conduction while maintaining effective heat dissipation.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If dual heat dissipation plates with lug bosses and through holes are used, then attachment uniformity is improved, but device complexity increases

Engineering Contradiction:

Improveattachment uniformityVSAvoidpackage structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heat dissipation system is segmented into dual heat dissipation plates with distributed lug bosses and through holes. This segmentation allows the attachment points to be distributed uniformly across the structure, improving attachment uniformity. The modular design with standardized lug bosses and through holes enables consistent positioning and attachment of heat generating components, reducing the impact of production tolerances.

Inventive Principle:

Principle #1Segmentation

3Manufacturing precision

If fix screws and nuts with adjustable torque and stroke are employed, then thermal conduction consistency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal conduction consistencyVSAvoidassembly process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent utilizes adjustable torque and stroke parameters of the fix screws to compensate for height variations in heat generating components. By controlling the torque applied to the fix screws and the stroke distance, the system achieves consistent pressing force on the thermal interface materials, ensuring uniform thermal conduction. This parameter adjustment capability allows the system to maintain thermal conduction consistency despite variations in component dimensions.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal conduction and dissipation efficiency by uniformly pressing heat-generating components against thermal interface materials, reducing deformation and ensuring consistent heat transfer across the package.

Implementation Method 1

enhances thermal conduction and dissipation efficiency by uniformly pressing heat-generating components against thermal interface materials

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250323121A1Semiconductor package and manufacturing method thereo

Publication Date: 2025.10.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation plate includes first through holes extended from the first upper surface to the first lower surface. The second heat dissipation plate has a second upper surface and a second lower surface. The second heat dissipation plate includes second through holes extended from the second upper surface to the second lower surface. The heat generating assemblies are disposed between the first heat dissipation plate and the second heat dissipation plate. The fixture components include fix screws and nuts. The fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes.