Leadframe Panel Assembly With Dual Plating for Multi-Chip Packaging
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Solution Overview
Problem
The integration of different types of semiconductor chips in a single package requires different leadframe surfaces, which can be costly due to expensive plating technologies, increasing overall package costs.
Innovation Solution
A method involving the use of separate leadframe panels with different plating materials for mounting different types of semiconductor chips, followed by mechanical connection and encapsulation to form a combined leadframe panel, allowing for efficient and cost-effective fabrication of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different leadframe surfaces are used for mounting different types of semiconductor chips, then proper mounting compatibility is achieved, but package costs increase due to expensive plating technologies
Solution Approach 1:
The leadframe panel is divided into multiple regions, each with different plating materials (e.g., first region with nickel plating, second region with copper plating). This segmentation allows different semiconductor chips to be mounted on appropriately plated regions without requiring expensive full-panel plating or additional plating steps for each chip type.
Solution Approach 2:
Different plating materials are applied to different local regions of the leadframe panel according to the specific mounting requirements of different chip types. This local quality approach ensures that each region has the optimal plating material for its intended chips, achieving proper mounting compatibility while avoiding the cost of uniform expensive plating across the entire panel.
2Ease of manufacture
If separate leadframe panels with different plating materials are mechanically connected, then cost-effective fabrication is achieved, but process complexity increases
Solution Approach 1:
Different plating materials are applied to different regions of the leadframe panel before the semiconductor chips are mounted. This preliminary action of differential plating simplifies subsequent chip mounting processes by ensuring each chip type is placed on the appropriate plating material from the start, avoiding the need for complex post-mounting plating operations or additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the integration of various semiconductor chips in a single package while reducing costs by utilizing distinct plating materials on separate leadframes, enhancing heat dissipation and signal routing capabilities.
Implementation Method 1
the first leadframes comprise multiple first diepads plated with a first plating material... the second leadframes comprise multiple second diepads plated with a second plating material different from the first plating material
Data Source
AI summary
A semiconductor package and method is disclosed. In one example, the method includes providing a first leadframe panel including multiple first leadframes, wherein the first leadframes include multiple first diepads plated with a first plating material. The method further includes providing a second leadframe panel separate from the first leadframe panel and including multiple second leadframes, wherein the second leadframes include multiple second diepads plated with a second plating material different from the first plating material. The method further includes mechanically connecting the first leadframe panel and the second leadframe panel to form a combined leadframe panel. The method further includes mounting a plurality of first semiconductor chips of a first type on the first leadframe panel, and mounting a plurality of second semiconductor chips of a second type different from the first type on the second leadframe panel.