Dual-Pressure Pressing Device for Fragile Electronic Components
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Solution Overview
Problem
Conventional pressing devices for electronic components apply severe and fluctuating downward pressures, which can lead to breakage or cracking of fragile chips, especially during testing, resulting in reduced efficiency and service life.
Innovation Solution
A device with a first and second downward-pressure generating mechanism, where the first pressure is applied to the test socket and the second pressure is applied to the electronic component, using a pneumatic or hydraulic system with distinct fluid chambers to control and stabilize the pressure, preventing sudden spikes and ensuring a steady contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a single downward-pressure generating device is used to press the electronic component onto the test socket, then the contact force between the component and test probes can be ensured, but severe pressure fluctuations occur that may break or fracture fragile chips
Solution Approach 1:
The single downward-pressure generating device is divided into two independent devices: a first downward-pressure generating device that applies pressure to the test socket, and a second downward-pressure generating device that applies pressure to the electronic component. This segmentation allows independent control of pressure applied to each object, eliminating the severe pressure fluctuations that occur when a single device presses both the component and socket simultaneously.
Solution Approach 2:
The depressing head serves as an intermediary structure that transmits force from the first downward-pressure generating device to the test socket, while the depressing piston transmits force from the second downward-pressure generating device to the electronic component. This intermediary structure enables differentiated pressure control between the socket and component.
2Reliability
If high downward pressure is applied to ensure full contact between contact points and probes, then testing reliability is improved, but the risk of breaking fragile chips increases
Solution Approach 1:
Different downward pressures are applied to different locations: the first downward-pressure generating device applies a first downward pressure to the test socket area, while the second downward-pressure generating device applies a second downward pressure to the electronic component area. This local quality differentiation allows optimized pressure control for each specific location, ensuring sufficient contact force while preventing chip breakage.
3Force
If a pneumatic damping device is used to provide buffer force, then the downward pressure can be controlled, but severe pressure fluctuations still occur during the depressing stroke
Solution Approach 1:
The system transitions from a static single-pressure control to a dynamic dual-pressure control system. The first and second downward-pressure generating devices can independently adjust their pressure output during the depressing stroke, allowing real-time optimization of pressure application to both the socket and component, thereby stabilizing the overall pressure profile and eliminating severe fluctuations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides stable and controlled downward pressures, reducing the risk of chip breakage and extending the service life by minimizing pressure fluctuations, allowing for precise and reliable electrical contact with test probes.
Implementation Method 1
using a pneumatic or hydraulic system with distinct fluid chambers to control and stabilize the pressure
Data Source
AI summary
A device for pressing an electronic component with different downward forces includes a first downward-pressure generating device, a depressing head, a second downward-pressure generating device and a depressing piston. The first downward-pressure generating device has the depressing head to apply a first downward pressure to the test socket and a portion of the electronic component. The second downward-pressure generating device has the depressing piston to apply a second downward pressure downward to another portion on the electronic component, so that the electronic component can couple electrically with a plurality of probe of the test socket. Thereupon, at least two downward-pressure generating devices are included to provide at least two different downward pressures to the electronic component solely or simultaneously to the electronic component and the testing equipment, such that specific downward-pressure requirements by precision electronic components can be fulfilled.