Dual Pressure Sensor Segmentation for Assembly and Repair
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Solution Overview
Problem
Conventional dual pressure sensors have high component counts, leading to time-consuming and inefficient assembly operations, and require replacing both pressure-sensitive diaphragm chips if one fails, which is uneconomical, and face challenges in achieving airtightness during assembly.
Innovation Solution
A dual pressure sensor design with an airtight container and two independent pressure sensor units, where each unit has a substrate with a small hole and a pressure connecting portion that protrudes from the container, reducing component count and allowing for simplified assembly and independent unit replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If two pressure-sensitive diaphragm chips are disposed in common on a single substrate, then the airtight container can be simplified, but if either chip fails, both chips must be replaced which is uneconomical
Solution Approach 1:
The patent divides the pressure sensor into two independent units, each with its own substrate and pressure-sensitive diaphragm chip. This segmentation allows individual replacement of failed chips without replacing the entire sensor assembly, resolving the contradiction between structural simplicity and repairability.
2Ease of manufacture
If two pressure connecting tubes are fabricated separately and attached passing through a lid portion of the airtight container, then pressure connection is achieved, but it requires an attachment with a high level of airtightness which complicates assembly
Solution Approach 1:
The patent merges the pressure connecting tube with the airtight container by forming the tube as an integral part of the container structure. This eliminates the need for separate attachment operations and ensures inherent airtightness, resolving the contradiction between assembly simplicity and airtightness reliability.
3Measurement precision
If two pressure-sensitive diaphragm chips are mounted on a substrate with wire bonding, then pressure measurement is achieved, but the component count is high and assembly operations are time-consuming
Solution Approach 1:
The patent segments the pressure sensor into independent units with integrated substrates for each pressure-sensitive diaphragm chip. This reduces the overall component count and simplifies assembly operations while maintaining pressure measurement precision, resolving the contradiction between measurement capability and assembly efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies assembly operations, improves airtightness, and allows for cost-effective maintenance by enabling replacement of only the faulty unit, enhancing productivity and reducing waste.
Implementation Method 1
pressure-sensitive diaphragm chips for detecting respective pressures to be measured by converting into electrical signals displacements of diaphragms due to the respective application of the pressures to be measured
Data Source
AI summary
A dual pressure sensor using a reduced number of parts to simplify its structure and having increased ease of assembly and improved air tightness. The dual pressure sensor has an airtight container, two pressure sensor units received in the airtight container so as to be in intimate contact with each other and a substrate. The pressure sensor units has two bases, two pressure sensing diaphragm chips, and an output correction circuit. The pressure sensing diaphragm chips are secured to the bases, respectively. The bases are constructed respectively from base bodies having communication paths formed inside them and also respectively from pressure introduction sections integral with and projecting from the base bodies. The pressure introduction sections respectively project outward from insertion holes formed in the airtight container.