Dual Pressurizing Electronic Component Mounting Apparatus
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Solution Overview
Problem
Conventional electronic component mounting apparatuses face complexity and increased costs due to the need for complicated mechanisms to switch between low and high bonding loads, with limited positioning for high-load applications and additional force transmission mechanisms.
Innovation Solution
An electronic component mounting apparatus featuring a mounting tool with a supporting mechanism and dual pressurizing mechanisms, a load detector, and a control unit for precise control of both low and high loads, utilizing a guiding mechanism like a leaf spring to facilitate vertical movement and reduce positional displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a second pressurizing mechanism is provided separately from the bonding head, then high load can be applied, but the positioning flexibility is limited
Solution Approach 1:
The second pressurizing mechanism for high-load application is merged with the mounting head structure rather than being provided separately. This integration allows the high-load pressurizing force to be applied at the same position as the bonding head, maintaining positioning flexibility while enabling high-load bonding capability.
2Adaptability or versatility
If a mechanism for switching transmission paths of pressurizing force is added, then load switching is enabled, but the apparatus becomes more complicated and costs increase
Solution Approach 1:
The control unit automatically selects and activates the appropriate pressurizing mechanism based on the required bonding load without requiring manual switching or complex transmission path switching mechanisms. The system self-manages the selection between low-load and high-load pressurizing modes, simplifying the overall apparatus structure while maintaining versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate application of both low and high loads with a simplified configuration, reducing apparatus complexity and costs while maintaining high precision and versatility in load application.
Implementation Method 1
a load detector connected to the mounting tool either directly or indirectly
Implementation Method 2
a first pressurizing mechanism configured to move the mounting tool in the vertical direction together with the supporting mechanism so as to apply a first load to the electronic component
Implementation Method 3
a second pressurizing mechanism provided between the supporting mechanism and the mounting tool, and configured to move the mounting tool in the vertical direction with respect to the supporting mechanism so as to apply a second load to the electronic component
Implementation Method 4
the control unit previously driving the second pressurizing mechanism to bring the load detector into contact with the supporting mechanism and generate precompression when the first load is applied by the first pressurizing mechanism
Data Source
AI summary
A mounting apparatus includes: a mounting tool; a supporting mechanism; a first pressurizing mechanism having a Z axis motor as a drive source for moving the mounting tool in the vertical direction together with the supporting mechanism so as to apply a first load to the electronic component; a second pressurizing mechanism having a VCM as a drive source provided between the supporting mechanism and the mounting tool, and for moving the mounting tool in the vertical direction with respect to the supporting mechanism so as to apply a second load to the electronic component; a load cell; and a control unit configured to control driving of the first pressurizing mechanism and the second pressurizing mechanism, the control unit previously driving the second pressurizing mechanism to bring the load cell into contact with the supporting mechanism and generate precompression when the first load is applied by the first pressurizing mechanism.