Dual Processing Chamber Substrate Transport for Throughput
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving high throughput while maintaining a reduced footprint, as adding more processing chambers increases the size of the transport robot and footprint.
Innovation Solution
The apparatus includes two processing chambers with adjacent substrate placing bases and a second substrate transport member, allowing simultaneous processing and controlled substrate placement to ensure equal heat conditions, thereby improving throughput and reducing footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a processing chamber is added to the outer peripheral portion of the transport chamber to improve throughput, then the throughput is improved, but the size of the transport robot becomes relatively large and the footprint is expanded
Solution Approach 1:
The patent transitions from a linear arrangement of processing chambers to a two-dimensional configuration where multiple processing chambers are arranged around the transport chamber in a circular pattern. This dimensional change allows the transport robot to service multiple chambers without increasing its size, as it can rotate to access different chambers rather than requiring linear extension.
Solution Approach 2:
The transport robot is designed with multi-functionality to service multiple processing chambers (first, second, and third processing chambers) with a single robot unit. The robot can transport substrates between the transport chamber and any of the processing chambers, eliminating the need for dedicated robots for each chamber and reducing the overall footprint.
2Productivity
If multiple processing chambers are arranged to improve throughput, then the number of processed substrates increases, but the transport robot size becomes relatively large
Solution Approach 1:
The patent arranges processing chambers in a circular pattern around the transport chamber, allowing the transport robot to access multiple chambers by rotation rather than by extending its arm length. This radial arrangement enables the robot to service three processing chambers with a compact size.
Solution Approach 2:
The system segments the processing function into multiple independent processing chambers (first, second, and third processing chambers) that can operate simultaneously or sequentially. Each chamber is accessible by the transport robot through rotational movement, allowing parallel processing operations without increasing robot size.
3Productivity
If substrates are placed on substrate placing base, then processing can occur, but the distance between substrate and heater may vary causing different heat conditions
Solution Approach 1:
The patent incorporates a control unit that monitors and adjusts the positions of substrate holding pins to ensure uniform distance between substrates and the heater. The control unit receives position information and adjusts the pins accordingly, providing feedback control to maintain consistent heating conditions across all substrates processed in parallel.
Solution Approach 2:
The system dynamically adjusts the position parameters of substrate holding pins to optimize the distance between substrates and the heater. By changing the positional parameters of the pins, the system ensures uniform heat distribution to all substrates regardless of their initial placement variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration doubles the throughput while maintaining a compact layout, ensuring consistent heat treatment and efficient substrate processing.
Implementation Method 1
a substrate placing base on which the substrates are placed
Data Source
AI summary
A substrate processing apparatus includes a transport chamber and a processing chamber that processes substrates. The transport chamber has a first substrate transport member transporting the substrates from the transport chamber to the processing chamber. The processing chamber has a first processing unit which is adjacent to the transport chamber and has a first substrate placing base, a second processing unit which is adjacent to the other side of the transport chamber in the first processing unit and has a second substrate placing base, a second substrate transport member transporting the substrates between the first processing unit and the second processing unit, and a control unit controlling at least the second substrate transport member.