Dual Pump Immersion Cooling System for High-Heat Components
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Solution Overview
Problem
Existing immersion cooling systems face challenges in efficiently addressing the cooling needs of devices that generate most of the heat and consume significant power due to inefficient energy usage by pumps circulating dielectric cooling liquids.
Innovation Solution
A dual-pump system is introduced, where one pump circulates dielectric cooling liquid within a container and another directs a flow of the liquid towards specific heat-generating electronic components, enhancing cooling efficiency while controlling temperature across the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a single pump circulates dielectric cooling liquid throughout the container, then the cooling liquid reaches all electronic components, but the energy consumption is significant and cooling efficiency for high-heat components is insufficient
Solution Approach 1:
The cooling system is segmented into two distinct circulation paths: a first pump circulates cooling liquid through the bulk container for general cooling, while a second pump directs cooling liquid specifically to high-heat-generating components. This segmentation allows optimized cooling delivery - the first pump maintains overall temperature control with lower energy consumption, while the second pump provides intensive cooling only where needed, resolving the contradiction between energy efficiency and cooling effectiveness for high-heat components.
2Temperature
If cooling liquid circulation is increased to cool the hottest devices, then cooling performance improves, but pump energy consumption increases significantly
Solution Approach 1:
The system applies local quality by directing enhanced cooling flow specifically to high-heat-generating components through the second pump, rather than uniformly increasing circulation throughout the entire container. The second pump creates a localized high-velocity cooling stream at critical heat-generating devices, achieving superior cooling performance at these specific locations without requiring the first pump to operate at high energy consumption levels for overall circulation.
3Loss of energy
If heat sinks are mounted on heat-generating devices, then thermal contact with cooling liquid improves, but the reduction in pump energy consumption is only modest
Solution Approach 1:
The system introduces an intermediary mechanism - the second pump - that actively directs cooling liquid flow to high-heat-generating components. This intermediary overcomes the limitation of passive heat sinks by creating a controlled, high-velocity cooling stream that enhances heat transfer efficiency. The second pump acts as a mediator between the cooling liquid and high-heat components, ensuring optimal thermal contact and heat removal without requiring excessive energy consumption from the primary circulation system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces energy consumption by optimizing cooling liquid circulation and direct delivery to heat-generating components, effectively managing temperature and improving cooling performance.
Implementation Method 1
Good thermal contact is obtained between the electronic components and the dielectric cooling liquid
Implementation Method 2
This requires the use of efficient pumps that consume a significant amount of energy
Data Source
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AI summary
A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components