Dual-Pump Path Plasma Processing Hardware
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Solution Overview
Problem
Conventional pumping systems in plasma processing apparatuses face issues with plasma discharge and chamber component erosion due to continuous pumping of plasma byproducts, especially during high RF voltage etch applications, which can lead to catastrophic failures and component erosion.
Innovation Solution
A dual-pump path system with configurable valves that switches between a path to the exhaust port and a path to the evacuation region, allowing pressure equalization and preventing plasma byproduct pumping through the lower electrode when the substrate is not present, thereby minimizing plasma arcing and component erosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If continuous pumping is used to lower pressure in the opening during processing, then plasma discharge and arcing are prevented, but chamber components suffer erosion from pumping plasma byproducts
Solution Approach 1:
The single pump path is segmented into two separate pump paths: a first pump path that operates during substrate processing to prevent plasma discharge, and a second pump path that operates during substrate removal to pump plasma byproducts away from chamber components. This segmentation allows each path to serve its specific function without causing harm to chamber components.
Solution Approach 2:
The system dynamically switches between the first and second pump paths based on the processing state. During substrate processing, the first pump path is active to maintain low pressure and prevent arcing. During substrate removal, the system switches to the second pump path to pump plasma byproducts. This dynamic switching resolves the contradiction by adapting the pumping configuration to the current operational phase.
2Productivity
If the single pump path continuously pumps plasma byproducts, then chamber pressure is controlled, but component erosion occurs leading to catastrophic failure
Solution Approach 1:
The pump system is divided into two separate paths with distinct functions. The first pump path handles pressure control during substrate processing, while the second pump path handles plasma byproduct removal during substrate removal. This segmentation ensures that plasma byproducts are pumped away from chamber components only when needed, preventing erosion and maintaining component integrity.
Solution Approach 2:
The second pump path acts as an intermediary mechanism that redirects plasma byproducts away from chamber components during substrate removal. By introducing this intermediate pumping path, the system can control pressure during processing while protecting components from erosion by plasma byproducts.
Data Source
AI summary
Embodiments disclosed herein generally relate to a pumping system for a plasma processing apparatus. The pumping system includes a first pump path, a second pump path, a first valve, and a second valve. The first pump path couples an opening of a substrate support assembly of the processing chamber to an exhaust port of the processing chamber. The second pump path couples the opening of the substrate support assembly to an evacuation region of the processing chamber. The first valve is positioned in the first pump path. The first valve is configurable between a first state and a second state. The second valve is positioned in the second pump path. The second valve is configurable between the first state and the second state.