Dual-Punch Card Substrate Device for Secure Window Integration
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Solution Overview
Problem
Existing methods for producing cards with light-transparent windows lack a secure mechanism to integrate the window into the card substrate, leading to potential displacement and instability during the punching process, especially in multi-layer substrates.
Innovation Solution
A device comprising a punching mechanism with dual functionality, where a first punch introduces an opening in the card substrate and a second punch punches out a window substrate, allowing simultaneous insertion of the window part into the opening, and a film joining device for securing the carrier film, enabling a compact and secure lamination process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single punch is used to both create the opening and punch out the window substrate, then the device structure is simplified, but the window substrate cannot be securely integrated into the card substrate
Solution Approach 1:
The single punch is divided into two separate punches: a first punch for creating the opening in the card substrate and a second punch for punching out the window substrate. This segmentation allows each punch to be optimized for its specific function, enabling secure integration of the window substrate while maintaining a relatively simple overall device structure.
2Adaptability or versatility
If the punching device is used only for punching operations, then the device function is single-purpose, but the device occupies excessive space when a separate joining device is added
Solution Approach 1:
The punching device is designed with multi-functionality by integrating a holding device that can operate in both punching mode and joining mode. The holding device can secure the card substrate during punching operations and subsequently serve as a support for the joining process, allowing the same device to perform multiple functions without requiring additional separate equipment, thus reducing the overall device footprint.
3Stability of the object's composition
If the card substrate is held firmly during punching, then positioning stability is improved, but the device structure becomes more complex
Solution Approach 1:
The holding device is designed to be self-adjusting and self-regulating. It automatically adapts to the card substrate being processed, providing stable positioning without requiring complex external control mechanisms. The holding device uses its own structural features to engage with the substrate and maintain stability throughout the punching and joining processes, eliminating the need for additional complex positioning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a stable and secure integration of the light-transparent window into the card substrate, preventing displacement and enhancing the production efficiency of joined cards with a compact device design.
Implementation Method 1
The film joining device (102) joins a carrier film (204) to a single-layer or multi-layer card substrate (200)
Data Source
Figure 1
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AI summary
The invention relates to a device (100) and a method for producing a joined card with a light-transparent window, comprising a foil joining device (102) and a punching device (104) which is adjustable perpendicular to the adjustment direction of its punching dies (112, 116) at least between a punching position and a joining position, wherein in the punching position a first punching die (112) and a first die (110) are positioned relative to a card substrate (200) such that, during the adjustment movement of the first punching die (112), they create an opening (208) in the card substrate (200), wherein a second punching die (116) and a second die (114) are positioned relative to the window substrate (202) such thatthat during the adjustment movement of the second punch (116), a window part (206) adapted to the dimensions of the opening (208) is punched out of the window substrate (202) in order to insert the window part (206) into the opening (208) by the simultaneous movement of the first punch (112) together with the second punch (116), and wherein, in the joining position, an area present on the first die (110) serves as a support (118) for a pressure plate (120) of the film joining device (102).